The present invention provides a terminal control method, a protective case, and a terminal. In the method, a terminal may be disposed with two Hall effect sensors for sensing a change of a magnetic field generated by a magnet in a protective case, and identify a forward snap-fit operation, an opening operation, a backward snap-fit operation, and the like of the protective case. When detecting the forward snap-fit operation of the protective case, the terminal performs a screen off operation; or when detecting the backward snap-fit operation of the protective case, the terminal may skip performing screen off operation. In embodiments of the present invention, the protective case can be prevented from turning off a screen by mistake, so as to improve terminal control accuracy.

A wireless earphone comprises a transceiver circuit for receiving streaming audio from a data source over a local ad hoc wireless network. When the data source and the earphone are out of range, they transition automatically to an infrastructure wireless network. If there is no common infrastructure wireless network for both the data source and the speakerphone set, the earphone connects to a host server via an available wireless network.

An electronic notification apparatus is disclosed. The electronic notification apparatus may include an image capture device which can scan a machine readable code on a physical object. A communication may thereafter be initiated to complete the transfer of the physical object to a user.

A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.

The camera module with improved heat dissipation function include a base, a photosensitive chip, a circuit board; and a heat conducting sheet. Wherein the base comprises a first surface and a second surface opposite to the first surface. A portion of the first surface is recessed to form a third surface between the first surface and the second surface, and to form a plurality of sidewalls connecting the first surface and the third surface, the third surface and the plurality of sidewalls cooperatively define a slot. Wherein the photosensitive chip is fixed on the third surface and accommodated in the slot; the circuit board is fixed on the first surface. A gap is defined between the circuit board and the photosensitive chip; the heat conducting sheet is disposed in the gap.

The embodiments of the present application disclose an electronic device, and the electronic device includes: a device body and a camera apparatus, where a sound-emitting device is installed in the device body, a first sound cavity is provided on the device body, the first sound cavity has an opening that communicates with the outside, the camera apparatus is detachably installed in the first sound cavity, in a case that the camera apparatus is installed in the first sound cavity, the sound cavity of the sound-emitting device has a first volume value, in a case that the camera apparatus is separated from the device body, the sound cavity of the sound-emitting device extends toward the first sound cavity and has a second volume value, and the first volume value is smaller than the second volume value.

An electronic device is provided. The electronic device includes a first part, a second part, a connection part disposed and coupled to the first part and the second part such that the first part and the second part are rotatable, a first antenna module disposed in the first part and includes an antenna array, a second antenna module disposed in the second part and includes an antenna array, a processor disposed in the first part, an IFIC disposed in the first part and electrically connected to the first antenna module and the processor, a second IFIC disposed in the second part and electrically connected to the second antenna module and the processor and an FPCB disposed over the first part, the connection part, and the second part, and is configured to transfer a digital signal or a baseband I/Q signal between the processor and the second IFIC.

The present disclosure discloses a telecommunications enclosure (1) and a method for coupling a cable (6) to a cable port (15) of the telecommunications enclosure (1). The latter comprises a casing (2) and a base (10) removably coupled to the casing (2). The base (10) comprises an outer structure (11) having an inner opening (12), and an inner assembly (130) comprising an inner structure (13), adapted to be removably inserted within the inner opening (12), and a plurality of sealing modules (14), each comprising a first part (14a) and a second part (14b). The outer structure (11) comprises a plurality of receiving portions (16) each having a recess (161) adapted to receive at least said first part (14a) of a respective sealing module (14) of the plurality of sealing modules (14). The base (10) is commutable between an assembled condition and a disassembled condition. In the assembled condition, the sealing modules (14), the inner structure (13) and the outer structure (11) are coupled to each other, the inner assembly (130) is inserted within the inner opening (12) of the outer structure (11) and, for each sealing module (14), at least said first part (14a) is received in the respective recess (161), the second part is coupled to the inner structure (13) and said first part (14a) and second part (14b) define a corresponding cable port (15). In the disassembled condition, at least part of the inner assembly (130) is removed from the inner opening (12) of the outer structure (13) to enable insertion of a cable (6) into the respective cable port (15). In both the assembled condition and disassembled condition, the plurality of receiving portions (16) of the outer structure (11) are connected to each other.

An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.

Disclosed is an electronic device including: a USB connector connected to a USB plug of an external device; a high-speed interface; a voltage source for supplying a voltage to the high-speed interface; a first circuit portion connected to a ground portion, and has a second impedance higher than a first impedance of the high-speed interface; and a processor. The processor is configured to monitor the external device by using the high-speed interface in a first interval of a first frame, form a disconnection sensing path by forming a connection between the first circuit portion and a second circuit portion of the external device, and use the disconnection sensing path to determine whether the connection between the USB connector and the USB plug has been disconnected. The second circuit portion may have a fourth impedance higher than a third impedance of an external high-speed interface. Various other embodiments are also possible.