An optical subsystem of a near-eye display system provides for projecting light of a virtual image of image content to an eye location, and provides for collecting light of the virtual image onto an exit pupil on a surface proximate to an outer surface of an eye when at the eye location. A subpupil modulator within an aperture in cooperation with the optical subsystem provides for forming a plurality of subpupils within the exit pupil, at least two of which overlap by at least 20 percent, and provides for less than all of the light of the virtual image associated with one or more less than all of the plurality of subpupils to be projected to the eye location.

A portable electronic device, and an image-capturing device and an assembling method thereof are provided. The image-capturing device includes a carrier substrate, a first image sensing chip, a first filter assembly and a first lens assembly. The first image sensing chip is disposed on the bottom side of the carrier substrate and electrically connected to the carrier substrate. The first filter assembly includes a first support element disposed on the carrier substrate and a first filter element configured for cooperating with the first support element. The first support element is configured to carry the first filter element such that all or a part of the first filter element can be received within the first through opening. The shortest distance between the first filter element and the first image sensing chip can range from 30 μm to 200 μm.

A portable electronic device, and an image-capturing device and an assembling method thereof are provided. The image-capturing device includes a carrier substrate, a first image sensing chip, a first filter assembly and a first lens assembly. The first image sensing chip is disposed on the bottom side of the carrier substrate and electrically connected to the carrier substrate. The first filter assembly includes a first support element disposed on the carrier substrate and a first filter element configured for cooperating with the first support element. The first support element is configured to carry the first filter element such that all or a part of the first filter element can be received within the first through opening. The shortest distance between the first filter element and the first image sensing chip can range from 30 μm to 200 μm.

A vision system includes an image sensor configured to be exposed to a scene during exposure times, a light emitting diode (LED) driver operatively connected to the image sensor, an LED associated with the image sensor and operatively connected to the LED driver, and one or more processing circuits that synchronize pulses of an enable signal to the exposure times of the image sensor so that each pulse of the enable signal overlaps with one of the exposure times. The pulses of the enable signal are used by the LED driver to cause the LED to output light to the scene.

A vision system includes an image sensor configured to be exposed to a scene during exposure times, a light emitting diode (LED) driver operatively connected to the image sensor, an LED associated with the image sensor and operatively connected to the LED driver, and one or more processing circuits that synchronize pulses of an enable signal to the exposure times of the image sensor so that each pulse of the enable signal overlaps with one of the exposure times. The pulses of the enable signal are used by the LED driver to cause the LED to output light to the scene.

Vision apparatus intended to be mounted on the head of a user, including: a night vision device, for forming first virtual images; an offsetting element, for projecting the first virtual images in the field of view of the user; a shutter, such that the offsetting element is between the shutter and the eye of the user, and able to have an open position that allows light to pass and a closed position that blocks light; a switching element with an open position that authorises emission of the first virtual images or the transfer thereof to the offsetting element, and a closed position that blocks the image emission or transfer; and a controlling device controlling the shutter and the switching element according to opening and closing cycles so the shutter is closed during all or a portion of the time during which the switching element is open, and inversely.

An electronic device includes at least one optical lens assembly. The optical lens assembly includes four lens elements, and the four lens elements are, in order from an outside to an inside, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an outside surface being convex in a paraxial region thereof. The second lens element has an inside surface being convex in a paraxial region thereof. The fourth lens element has an inside surface being concave in a paraxial region thereof, wherein at least one of an outside surface and the inside surface of the fourth lens element includes at least one critical point in an off-axis region thereof.

There is provided an information processing apparatus capable of estimating a three-dimensional shape of an object surface with higher definition. The information processing apparatus includes: a depth information estimating unit that estimates first depth information on the basis of a first detected position of irradiation light by an irradiator, the first detection position being output from a first sensor that detects a position where a luminance change greater than or equal to a first threshold value has occurred; and an integrated processing unit that estimates three-dimensional information on the basis of the first depth information and position and orientation information of the first sensor at each of a plurality of times.

The disclosure discloses a large-aperture infrared metalens camera, which belongs to the technical field of infrared imaging and micro-nano photonics, including a large-aperture metalens, an infrared focal plane array detector, a metalens mechanical assembly and a housing. The large-aperture metalens has an aperture greater than 50 mm and a thickness less than 2 mm, and the distance between the large-aperture metalens and the infrared focal plane array detector is greater than 30 mm. The metalens mechanical assembly uses a buffer structure to fix, adjust and protect the metalens from shocks. The housing is sealed through a thermal insulation coating, thus providing heat insulation and waterproof protection for the lens. The disclosure adopts strict electromagnetic field values, diffraction design algorithm and large-area semiconductor process manufacturing method to increase the aperture of metalens to 50 mm or more, and considerably improves the focal length and magnification of the camera while ensuring that the F-number of the metalens meets the requirements of signal-to-noise ratio of image. The problems of short focal length, small magnification, and insufficient imaging range of conventional metalens cameras are overcome, thus realizing detection and imaging of objects at medium and long ranges.

The disclosure discloses a large-aperture infrared metalens camera, which belongs to the technical field of infrared imaging and micro-nano photonics, including a large-aperture metalens, an infrared focal plane array detector, a metalens mechanical assembly and a housing. The large-aperture metalens has an aperture greater than 50 mm and a thickness less than 2 mm, and the distance between the large-aperture metalens and the infrared focal plane array detector is greater than 30 mm. The metalens mechanical assembly uses a buffer structure to fix, adjust and protect the metalens from shocks. The housing is sealed through a thermal insulation coating, thus providing heat insulation and waterproof protection for the lens. The disclosure adopts strict electromagnetic field values, diffraction design algorithm and large-area semiconductor process manufacturing method to increase the aperture of metalens to 50 mm or more, and considerably improves the focal length and magnification of the camera while ensuring that the F-number of the metalens meets the requirements of signal-to-noise ratio of image. The problems of short focal length, small magnification, and insufficient imaging range of conventional metalens cameras are overcome, thus realizing detection and imaging of objects at medium and long ranges.