An optical system has a virtual lens comprising an array of image sensors and processor in communication with the virtual lens and configured to focus the at least one virtual lens by way of mathematical image processing of a dynamic object plane.

An image processing system is disclosed, comprising: an M-lens camera, a compensation device and a correspondence generator. The M-lens camera generates M lens images. The compensation device generates a projection image according to a first vertex list and the M lens images. The correspondence generator is configured to conduct calibration for vertices to define vertex mappings, horizontally and vertically scan each lens image to determine texture coordinates of its image center, determine texture coordinates of control points according to the vertex mappings, and P1 control points in each overlap region in the projection image; and, determine two adjacent control points and a coefficient blending weight for each vertex in each lens image according to the texture coordinates of the control points and the image center in each lens image to generate the first vertex list, where M>=2.

Disclosed is an electronic device including a camera module including at least one lens, a display including a camera exposure region at least partially overlapping with the lens and a border region surrounding a periphery of the camera exposure region in a direction corresponding to an optical axis of the lens, and a processor operatively connected to the camera module and the display. When a shooting-related application is executed or when the camera module is activated, the processor may control a luminance of the border region to be within a specified range. Besides, various embodiments as understood from the specification are also possible.

Disclosed is an electronic device including a camera module including at least one lens, a display including a camera exposure region at least partially overlapping with the lens and a border region surrounding a periphery of the camera exposure region in a direction corresponding to an optical axis of the lens, and a processor operatively connected to the camera module and the display. When a shooting-related application is executed or when the camera module is activated, the processor may control a luminance of the border region to be within a specified range. Besides, various embodiments as understood from the specification are also possible.

An endoscope includes a scope provided with a hard portion at a distal end of a long flexible portion having flexibility; an image capturing portion housed in the hard portion and having an image sensor; a transmission cable inserted into the scope and conductively connected to the image sensor at a distal end via a substrate, and a voltage conversion device mounted on the substrate and outputting a constant voltage to the image sensor with respect to a input voltage input to the transmission cable.

A hand-held or otherwise portable or spatial or temporal performance-based image capture device includes one or more lenses, an aperture and a main sensor for capturing an original main image. A secondary sensor and optical system are for capturing a reference image that has temporal and spatial overlap with the original image. The device performs an image processing method including capturing the main image with the main sensor and the reference image with the secondary sensor, and utilizing information from the reference image to enhance the main image. The main and secondary sensors are contained together within a housing.

A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.

An apparatus comprises: a camera module for obtaining a first image, the camera module having at least one port, each of the at least one ports being associated with an attachment position for receiving a second camera module for obtaining a second image; a processor for detecting a position of a second camera module and providing, to an image processing controller, information relating to at least one of the position of the second camera module and the first image obtained by the camera module; and a memory for storing the information relating to at least one of the position of the second camera module and the first image obtained by the camera module.

An electronic device includes a first camera supporting a first FOV, a second camera supporting a second FOV, and a processor. The processor is configured to obtain a first image having the first FOV using the first camera, to obtain a second image, which is associated with the first image and has the second FOV using the second camera, to adjust at least one operation attribute of the first camera based on the second image, and to obtain a third image having the first FOV based on the adjusted at least one operation attribute using the first camera.