An imaging device having a function of processing an image is provided. The imaging device has an additional function such as image processing, can hold analog data obtained by an image capturing operation in a pixel, and can extract data obtained by multiplying the analog data by a predetermined weight coefficient. Difference data between adjacent light-receiving devices can be obtained in a pixel, and data on luminance gradient can be obtained. When the data is taken in a neural network or the like, inference of distance data or the like can be performed. Since enormous volume of image data in the state of analog data can be held in pixels, processing can be performed efficiently.

A solid-state imaging device that includes a first substrate, one or multiple second substrates, a first wiring layer, a second wiring layer, and a first alignment part. The first substrate includes a first semiconductor substrate with multiple photoelectric conversion sections, and a multilayer wiring layer. The one or multiple second substrates are attached to the first substrate with the multilayer wiring layer interposed therebetween. The first wiring layer is in the multilayer wiring layer and includes multiple first thin metal wires formed at substantially the same first pitches. The second wiring layer is stacked above the first wiring layer in the multilayer wiring layer and includes multiple second thin metal wires formed between the multiple first thin metal wires at substantially the same second pitches in a plan view. The first alignment part is formed above the second wiring layer in the multilayer wiring layer.

The present invention relates to a highly functional imaging device that can be manufactured through a small number of steps. A first stacked body is formed in which a circuit provided with a transistor including a metal oxide in its channel formation region (hereinafter, OS transistor) is stacked over a circuit including a Si transistor. A second stacked body is formed in which an OS transistor is provided over a Si photodiode. Layers including the OS transistors of the first stacked body and the second stacked body are bonded to each other to obtain electrical connection between circuits. With such a structure, even when a structure is employed in which a plurality of circuits having different functions are stacked, the number of polishing steps and bonding steps can be reduced, improving the yield.

To prevent attenuation and modulation of light received or projected through a display surface.

An image display device includes a plurality of pixels arranged two-dimensionally. A pixel in a first pixel region including some pixels among the plurality of pixels includes a first light emitting region, a second light emitting region having a higher visible light transmittance than the first light emitting region, a first self-light emitting element that emits light from the first light emitting region, and a second self-light emitting element that emits light from the second light emitting region, and a pixel in a second pixel region other than the first pixel region among the plurality of pixels includes a third light emitting region having a lower visible light transmittance than the second light emitting region, and a third self-light emitting element that emits light from the third light emitting region.

The present technology relates to a solid-state image pickup element, electronic equipment, and a semiconductor apparatus that make it possible to reduce a surface reflection in an area in which a slit is formed and improve flare characteristics. A solid-state image pickup element includes a pixel area in which a plurality of pixels is two-dimensionally arranged in a matrix, a chip mounting area in which a chip is flip-chip mounted, and a dam area that is arranged around the chip mounting area and in which one or more slits that block an outflow of a resin are formed. In the dam area, the same OCL as that in the pixel area is formed. The present technology can be applied to a solid-state image pickup element etc. in which a chip is flip-chip mounted, for example.

A multifunctional imaging device is provided. The imaging device includes first to fourth light-receiving elements and first and second functional layers. The first to fourth light-receiving elements are photoelectric conversion elements having sensitivity to light of different wavelengths from each other. The first and second functional layers each include first and second transistors. The first functional layer and the fourth to first light-receiving elements are stacked in this order over the second functional layer. In each of the first to fourth light-receiving elements, a first conductive layer, a first buffer layer, a photoelectric conversion layer, a second buffer layer, and a second conductive layer are stacked in this order. The photoelectric conversion layer includes an organic compound, and the first buffer layer and the second buffer layer each include a metal or an organic compound. The first transistor is electrically connected to the first conductive layer of any of the first to fourth light-receiving elements. The second transistor is electrically connected to the first transistor.

A solid-state image sensor including a wafer substrate including photoelectric conversion elements, a filter module formed over the wafer substrate and including different color filters each aligned with a different one of the photoelectric conversion elements, each of the color filters being formed in a different one of color filter regions, and a microlens module including microlenses each aligned with a different one of the color filters. The microlens module includes main lenses each formed within a corresponding one of the color filter regions in a plan view, and auxiliary lenses formed in different corner portions of the color filter regions, and having a lens parameter different from a lens parameter of the main lenses.

A stacked image sensor includes a signal-processing circuitry layer, a pixel-array substrate, a heat-transport layer, and a thermal via. The signal-processing circuitry layer includes a conductive pad exposed on a circuitry-layer bottom surface of the signal-processing circuitry layer. The pixel-array substrate includes a pixel array and is disposed on a circuitry-layer top surface of the signal-processing circuitry layer. The circuitry-layer top surface is between the circuitry-layer bottom surface and the pixel-array substrate. The heat-transport layer is located between the signal-processing circuitry layer and the pixel-array substrate. The thermal via thermally couples the heat-transport layer to the conductive pad.

An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.

In an imaging element including a polarizer, accuracy of obtained polarization information is improved. The imaging element includes a polarizer and a photoelectric conversion element, from the incident light side. A plurality of types of polarizing members is arranged on the polarizer. The plurality of types of polarizing members is polarizing members having the same internal structures, and is formed as the plurality of types of polarizing members by rotationally moving or symmetrically moving one of the polarizing members. The photoelectric conversion element converts light incident through each of the plurality of types of polarizing members into electric charges.