A display device includes: a display panel; a first sound generator on a first surface of the display panel, the first sound generator being configured to vibrate the display panel to output a first sound; and a second sound generator configured to output a second sound. A third sound is a sum of the first sound and the second sound, and a sound pressure level of at least one of harmonic tones of the third sound is less than a sound pressure level of at least one of harmonic tones of the first sound.

A speaker unit for an earphone is provided. The speaker unit for an earphone may include a frame; a magnet; a plate fixed to the frame and in contact with the magnet; a diaphragm; a coil disposed to overlap the magnet and the plate in a radial direction; and a flexible printed circuit board (FPCB), wherein the magnet includes a first surface and a second surface arranged on an outer surface of the magnet, the first surface is a surface in contact with an inner surface of the frame, the second surface is a surface spaced apart from the inner surface of the frame, and the frame forms a first sound emission path defined by a space between the inner surface thereof and the second surface of the magnet in the radial direction.

A sensor package substrate has through holes V1 and V2 at a position overlapping a sensor chip mounting area. The through hole V1 has a minimum inner diameter at a depth position D1, and the through hole V2 has a minimum inner diameter at a depth position D2 different from the depth position D1. Thus, since the plurality of through holes are formed at a position overlapping the sensor chip mounting area, the diameter of each of the through holes can be reduced. This makes foreign matters unlikely to enter through the through holes, and a reduction in the strength of the substrate is suppressed. In addition, since the depth position D1 and depth position D2 are located at different depth levels, it is possible to sufficiently maintain the strength of a part of the substrate that is positioned between the through holes V1 and V2.

According to one of aspects, provided is an electronic device including a panel 10, a piezoelectric element 30 attached to the panel 10, and a substrate 25 attached to a main surface of the piezoelectric element 30. The panel 10 is configured to be deformed due to deformation of the piezoelectric element 30, and sound is transmitted to an object that is in contact with the deformed panel 10. The substrate 25 includes a base 25a made of resin, and signal lines 25b and 25c laminated with the base 25a and connected to the main surface of the piezoelectric element 30. The substantially the entire main surface of the piezoelectric element 30 is covered by the base 25a.

According to one of aspects, provided is an electronic device including a panel 10, a piezoelectric element 30 attached to the panel 10, and a substrate 25 attached to a main surface of the piezoelectric element 30. The panel 10 is configured to be deformed due to deformation of the piezoelectric element 30, and sound is transmitted to an object that is in contact with the deformed panel 10. The substrate 25 includes a base 25a made of resin, and signal lines 25b and 25c laminated with the base 25a and connected to the main surface of the piezoelectric element 30. The substantially the entire main surface of the piezoelectric element 30 is covered by the base 25a.

Low-profile electronic component apparatus and methods of manufacturing and utilizing the same, for use with low-profile mobile devices and other applications. In one embodiment, the mobile device comprises a wireless-enabled smartphone, tablet, or laptop computer, and the component comprises an audio speaker which is recessed into a metallic support element, the latter recessed into the mobile device outer housing. The support element is coated with an insulating material, and conductive traces formed thereon for electrical interface with the contacts of the speaker. When assembled, the installation results in a substantially reduced overall vertical profile, thereby both potentially reducing the overall required thickness of the host device, and creating additional volume within the device housing (such as for other components, and/or enhanced audio response of the speaker) resulting in an additional spacing between the speaker component and any extant antenna assemblies.

Low-profile electronic component apparatus and methods of manufacturing and utilizing the same, for use with low-profile mobile devices and other applications. In one embodiment, the mobile device comprises a wireless-enabled smartphone, tablet, or laptop computer, and the component comprises an audio speaker which is recessed into a metallic support element, the latter recessed into the mobile device outer housing. The support element is coated with an insulating material, and conductive traces formed thereon for electrical interface with the contacts of the speaker. When assembled, the installation results in a substantially reduced overall vertical profile, thereby both potentially reducing the overall required thickness of the host device, and creating additional volume within the device housing (such as for other components, and/or enhanced audio response of the speaker) resulting in an additional spacing between the speaker component and any extant antenna assemblies.

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Embodiments are directed to a micro transducer array comprising a shared motor system having a base plate and mounting interfaces to a frame of a portable electronic device; a first transducer comprising a first magnet disposed between the base plate and a first top plate, and a first diaphragm projecting sound out of a surface of the portable device; a second transducer comprising a second magnet disposed between the base plate and a second top plate, and a second diaphragm projecting sound of an opposite surface of the portable device; a first pair of input terminals inputting a first audio signal to the first transducer; and a second pair of input terminals inputting a second audio signal to the second transducer.