Embodiments are directed to a micro transducer array comprising a shared motor system having a base plate and mounting interfaces to a frame of a portable electronic device; a first transducer comprising a first magnet disposed between the base plate and a first top plate, and a first diaphragm projecting sound out of a surface of the portable device; a second transducer comprising a second magnet disposed between the base plate and a second top plate, and a second diaphragm projecting sound of an opposite surface of the portable device; a first pair of input terminals inputting a first audio signal to the first transducer; and a second pair of input terminals inputting a second audio signal to the second transducer.

Novel active phantom-powered ribbon microphones that provide switchable proximity effect response filtering for voice and music applications are disclosed with unique adjustable interfaces. In one embodiment of the invention, a slider-based full frequency response vs. low frequency response and high pass filtering adjustment interface on a surface of a microphone casing provides a convenient switching between a “Music” mode and a “Voice” mode, wherein the “Voice” mode reduces the undesirable proximity effect in an active phantom-powered ribbon microphone, when a sound source is situated overly close to the active phantom-powered ribbon microphone. Furthermore, in one embodiment of the invention, a slider-based or a knob-based variable voice mode adjustment interface can also be integrated on a surface of a microphone casing to provide various preset levels of low frequency reduction and/or proximity effect response filtering when the “Voice” mode is enabled.

Novel active phantom-powered ribbon microphones that provide switchable proximity effect response filtering for voice and music applications are disclosed with unique adjustable interfaces. In one embodiment of the invention, a slider-based full frequency response vs. low frequency response and high pass filtering adjustment interface on a surface of a microphone casing provides a convenient switching between a “Music” mode and a “Voice” mode, wherein the “Voice” mode reduces the undesirable proximity effect in an active phantom-powered ribbon microphone, when a sound source is situated overly close to the active phantom-powered ribbon microphone. Furthermore, in one embodiment of the invention, a slider-based or a knob-based variable voice mode adjustment interface can also be integrated on a surface of a microphone casing to provide various preset levels of low frequency reduction and/or proximity effect response filtering when the “Voice” mode is enabled.

A headphone includes an ear-cup housing having an internal surface defining an internal chamber, a hole extending through the ear-cup housing, and a cable anchor device within the ear-cup housing proximate the hole. The cable anchor device includes a first support member attached to the internal surface on a first side of the hole, a second support member attached to the internal surface on a second side of the hole opposite the first side, and a cross member extending between the first support member and the second support member. A method of fabricating a headphone having such a cable anchor device includes inserting a cable through a cable hole extending through the ear-cup housing and wrapping the cable around the cross member of the cable anchor device at least once.

A headphone includes an ear-cup housing having an internal surface defining an internal chamber, a hole extending through the ear-cup housing, and a cable anchor device within the ear-cup housing proximate the hole. The cable anchor device includes a first support member attached to the internal surface on a first side of the hole, a second support member attached to the internal surface on a second side of the hole opposite the first side, and a cross member extending between the first support member and the second support member. A method of fabricating a headphone having such a cable anchor device includes inserting a cable through a cable hole extending through the ear-cup housing and wrapping the cable around the cross member of the cable anchor device at least once.

Provided is a PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate; providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate; providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer; and releasing the sacrificial layer and the diaphragm layer remains. With the micromachining method for the above PCB substrate and the diaphragm, the production cost of the speaker can be lowered, and the reliability of the product can be improved at the same time.

Headphone assemblies, related components such as headband assemblies and ear cup assemblies, and methods of operation and assembly are disclosed herein. Some of the headphone assemblies include a headband assembly and a first and second ear cup assembly, the ear cup assemblies having attachment mechanisms adapted to reversibly mate with counterpart attachment mechanisms in the headband assembly such that the ear cup assemblies can each be readily replaced or exchanged, and such that each ear cup assembly connects mechanically and electrically to the headband assembly. Some of the headphone assemblies include one or more cambering features that cause an attachment mechanism on the headphone assembly, or a first reference plane defined by an inwardly-facing surface of the first ear cup assembly, to change its orientation relative to the headband assembly or a first arm thereof, in response to pivotal or extensible articulation of the headband assembly over a range of motion.

A microphone is provided that ensures the electrical connection between a unit case and an audio-signal output circuit board. The microphone includes a unit case 10 having a shape of a hollow cylinder with a closed end and accommodating an electroacoustic transducer 20, an audio-signal output circuit board 40 connected to the electroacoustic transducer, and a microphone case accommodating the unit case and the audio-signal output circuit board, wherein the audio-signal output circuit board has a receiver 41 disposed on a portion of the peripheral edge of the audio-signal output circuit board, and an open end 11 of the unit case comes into contact with the receiver and is positioned when the unit case and the audio-signal output circuit board are accommodated in the microphone case.

The present invention relates to the technical field of electroacoustic products. Disclosed is a miniature speaker. The miniature speaker comprises an upper housing and a lower housing combined together. A vibration system and a magnetic circuit system are accommodated in the space defined by the upper housing and the lower housing. The upper housing is disposed close to the vibration system. The miniature speaker also comprises a hearing-aid voice coil. The hearing-aid voice coil is fixed to the upper housing and is located at the inner side of the upper housing. The miniature speaker of the present invention solves the problem of poor acoustics caused by collision of a lead wire of a vibrating voice coil with a hearing-aid voice coil of a miniature speaker in the prior art, and the miniature speaker of the present invention has good acoustic performance and a better hearing-aid effect.

An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.