An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.

The present disclosure discloses a loudspeaker apparatus. The loudspeaker apparatus may include an ear hook, a core housing, and a circuit housing. The ear hook may include a first plug end and a second plug end. The ear hook may be surrounded by a protective sleeve. The protective sleeve may be made of an elastic waterproof material. The core housing may be used for accommodating an earphone core. The core housing may be fixed to the first plug end and elastically abutted against the protective sleeve. The circuit housing may be used for accommodating a control circuit or a battery. The circuit housing may be fixed to the second plug end. The control circuit or the battery may drive the earphone core to vibrate. The vibration of the earphone core may generate a driving force to drive a housing panel of the core housing to vibrate. The driving force may be not parallel to a normal line of the housing panel. In the present disclosure, the core housing may elastically abut against the protective sleeve surrounding the ear hook to improve the overall waterproof effect of the loudspeaker apparatus and simplify the manufacturing and assemble process of the loudspeaker apparatus.

The present disclosure relates to a speaker device. The speaker device may include a speaker assembly and a supporting connector. The speaker assembly may include a speaker module and a button module. The supporting connector may be configured to contact with the human head and provide a vibration fulcrum for a vibration of the speaker assembly. A distance between a center of the button module and the vibration fulcrum may be not greater than a distance between a center of the speaker module and the vibration fulcrum.

The present disclosure relates to a speaker device. The speaker device may include a speaker assembly and a supporting connector. The speaker assembly may include a speaker module and a button module. The supporting connector may be configured to contact with the human head and provide a vibration fulcrum for a vibration of the speaker assembly. A distance between a center of the button module and the vibration fulcrum may be not greater than a distance between a center of the speaker module and the vibration fulcrum.

A microelectromechanical system (MEMS) transducer includes a transducer substrate including an opening; a back plate including a plurality of protrusions oriented substantially perpendicular to the back plate; and a diaphragm between the transducer substrate and the back plate. The diaphragm includes a lead and a plurality of spring members. The lead is structured to suspend the diaphragm over the transducer substrate. The spring members are structured to separate the diaphragm from the transducer substrate and the back plate in the absence of a bias voltage.

A microelectromechanical system (MEMS) transducer includes a transducer substrate including an opening; a back plate including a plurality of protrusions oriented substantially perpendicular to the back plate; and a diaphragm between the transducer substrate and the back plate. The diaphragm includes a lead and a plurality of spring members. The lead is structured to suspend the diaphragm over the transducer substrate. The spring members are structured to separate the diaphragm from the transducer substrate and the back plate in the absence of a bias voltage.

A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.

A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.

A sound generator includes a sound generating body, a base, a protection wall, and an erected wall. The sound generating body includes a diaphragm and a driving portion. The base includes a base tubular portion and a partition wall defining a sound hole. The diaphragm and the partition wall divide an inner space of the base tubular portion into a first space and a second space. The protection wall is disposed away from the partition wall and the erected wall connects between the protection wall and the base tubular portion. The protection wall, the erected wall, and the partition wall defines a sound emission space in communication with the first space through the sound hole. The protection wall and the erected wall define an emission hole through which the sound exits.

The present invention provides a microspeaker having a water drainage structure capable of rapidly discharging water, entering the microspeaker, to the outside. In the case of a woofer-tweeter speaker, water is discharged through the side and bottom of a housing, and in the case of a 1-way speaker, water is discharged through the side of a housing. In addition, the present invention provides a connection portion that is formed to position a plurality of soldering points, to which a woofer wire and a tweeter wire are bonded, not outside a driver but inside or at the boundary of a space formed by the driver in a TWS-type 2-way microspeaker. This secures design freedom and save space by reducing the overall length of a small speaker.