A wireless sound-emitting device includes a housing adapted to be coupled to a wall at a source of electric power, a loudspeaker positioned at a periphery of the housing, a control module outputting an electric audio signal to the at least one loudspeaker, and a wireless communications module in electrical communication with the control module. The loudspeaker emits acoustic signals in a direction parallel to the wall, when the housing is coupled to the wall, with the acoustic signals reflecting off the wall. The device may produce a sound masking noise or play a sound recorded on an internal memory. The device may include an electric plug or be adapted to replace an electric outlet faceplate. The device may have electric pass-through outlets and may be powered by the source of electric power. The device may be controlled remotely, for example via an Internet of Things (IoT) platform.

A wireless sound-emitting device includes a housing adapted to be coupled to a wall at a source of electric power, a loudspeaker positioned at a periphery of the housing, a control module outputting an electric audio signal to the at least one loudspeaker, and a wireless communications module in electrical communication with the control module. The loudspeaker emits acoustic signals in a direction parallel to the wall, when the housing is coupled to the wall, with the acoustic signals reflecting off the wall. The device may produce a sound masking noise or play a sound recorded on an internal memory. The device may include an electric plug or be adapted to replace an electric outlet faceplate. The device may have electric pass-through outlets and may be powered by the source of electric power. The device may be controlled remotely, for example via an Internet of Things (IoT) platform.

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

A speaker structure according to various embodiments disclosed in the present document may comprise: a speaker housing which receives a diaphragm to which a voice coil is fixed and the speaker housing has a first surface and a second surface opposite to the first surface; a cover plate disposed on the first surface of the speaker housing; a yoke disposed on the second surface of the speaker housing; first and second pads disposed on the second surface of the speaker housing and electrically connected to the voice coil; and a connection member electrically connected to the first pad and the second pad, wherein the connection member may have a portion connecting the first pad and the second pad, and may be disposed on the yoke. Various other embodiments are also possible.

A speaker unit for an earphone is provided. The speaker unit for an earphone may include a frame; a magnet; a plate fixed to the frame and in contact with the magnet; a diaphragm; a coil disposed to overlap the magnet and the plate in a radial direction; and a flexible printed circuit board (FPCB), wherein the magnet includes a first surface and a second surface arranged on an outer surface of the magnet, the first surface is a surface in contact with an inner surface of the frame, the second surface is a surface spaced apart from the inner surface of the frame, and the frame forms a first sound emission path defined by a space between the inner surface thereof and the second surface of the magnet in the radial direction.

The present disclosure relates to a loudspeaker. The loudspeaker may include an earphone core, an auxiliary function module, and a flexible circuit board. The earphone core may be configured to convert an electric signal into a vibration signal. The auxiliary function module may be configured to receive an auxiliary signal and execute an auxiliary function. The flexible circuit board may be configured to electrically connect to an audio signal wire and an auxiliary signal wire of an external control circuit, and electrically connect the audio signal wire and the auxiliary signal wire with the earphone core and the auxiliary function module via the flexible circuit board, respectively. The loudspeaker in the present disclosure may simplify the wire routing and improve sound quality.

The present disclosure relates to a loudspeaker. The loudspeaker may include an earphone core, an auxiliary function module, and a flexible circuit board. The earphone core may be configured to convert an electric signal into a vibration signal. The auxiliary function module may be configured to receive an auxiliary signal and execute an auxiliary function. The flexible circuit board may be configured to electrically connect to an audio signal wire and an auxiliary signal wire of an external control circuit, and electrically connect the audio signal wire and the auxiliary signal wire with the earphone core and the auxiliary function module via the flexible circuit board, respectively. The loudspeaker in the present disclosure may simplify the wire routing and improve sound quality.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.