A suspension component may be used within a system for isolating vibrations produced by an electrical component. A body of the suspension component may be formed from a single piece of planar material. A suspension component includes a plurality of flexures. The plurality of flexures includes a first set of flexures configured to suspend a first sub-assembly of a transducer from support brackets, a second set of flexures configured to suspend a second sub-assembly of the transducer from the first sub-assembly, and a third set of flexures configured to suspend the second sub-assembly from the support brackets.

An electrodynamic actuator for a speaker or an electrodynamic acoustic transducer in general is disclosed, which comprises at least one voice coil, a magnet system and an arm arrangement of a plurality of arms connecting the at least one voice coil and the magnet system or at least a movable part thereof so that a relative movement between these parts is allowed. The arms are made of a metal core, which at least partly is coated with a coating structure having at least one coating metal layer consisting of a different material than the metal core.

An electrodynamic actuator for a speaker or an electrodynamic acoustic transducer in general is disclosed, which comprises at least one voice coil, a magnet system and an arm arrangement of a plurality of arms connecting the at least one voice coil and the magnet system or at least a movable part thereof so that a relative movement between these parts is allowed. The arms are made of a metal core, which at least partly is coated with a coating structure having at least one coating metal layer consisting of a different material than the metal core.

Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.

Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.

A sound producing package structure includes a plurality of chips disposed within a cavity. The chips includes a first chip and a second chip, the first chip includes a first sound producing membrane and a first actuator attached to the first sound producing membrane, and a second chip includes a second sound producing membrane and a second actuator attached to the second sound producing membrane. The first sound producing membrane and the second sound producing membrane are actuated toward a center of the cavity in a synchronous fashion so as to produce a sound pressure.

A sound producing package structure includes a plurality of chips disposed within a cavity. The chips includes a first chip and a second chip, the first chip includes a first sound producing membrane and a first actuator attached to the first sound producing membrane, and a second chip includes a second sound producing membrane and a second actuator attached to the second sound producing membrane. The first sound producing membrane and the second sound producing membrane are actuated toward a center of the cavity in a synchronous fashion so as to produce a sound pressure.

An acoustic receiver includes a cover made from an electrically non-conductive material configured to cover an open end of a housing portion of the acoustic receiver. The cover has an inner surface and an outer surface. A motor is disposed on the inner surface, while electrical contacts are disposed on the outer surface. The motor is connected to the electrical contacts on the outer surface. Various electrical components, such as integrated circuits and sensors, are disposed on the outer surface. In one embodiment, the cover is a printed circuit board.

An acoustic receiver includes a cover made from an electrically non-conductive material configured to cover an open end of a housing portion of the acoustic receiver. The cover has an inner surface and an outer surface. A motor is disposed on the inner surface, while electrical contacts are disposed on the outer surface. The motor is connected to the electrical contacts on the outer surface. Various electrical components, such as integrated circuits and sensors, are disposed on the outer surface. In one embodiment, the cover is a printed circuit board.

Provided is an MEMS device, including: a substrate having back cavity passing thererthrough; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes, and accommodating space formed therebetween; a counter electrode; and support loop members arranged concentrically. Opposite ends of the support loop member are connected to the first and second membranes. The support loop members are arranged at intervals. Each support loop member has first sections concentrically arranged as a loop member at intervals. A first notch is formed between two adjacent first sections. In at least one support loop member, the first section has second sections concentrically arranged as a loop member at intervals. A second notch is formed between two adjacent second sections. By a larger first section, distance between adjacent first sections is larger, the technical problem that large number of slots required for counter electrode is solved.