A balanced armature receiver is disclosed that includes a housing and an armature assembly within the housing. The armature assembly includes a first armature portion and a second armature portion. The first armature portion and the second armature portion are operated such that the second armature portion is substantially unstable relative to the first armature portion.

An earphone has a membrane mounted on a membrane carrier and arranged between a top space and a bottom space; a membrane actuator implemented to deflect the membrane in dependence on a control signal; a housing where the membrane carrier, the membrane and the membrane actuator are arranged, wherein the housing has a sound exit, wherein the membrane carrier has openings, and wherein the membrane has holes, and wherein the openings and the holes connect the top space and the bottom space to each another, such that gas can move through the openings and holes between the top space and the bottom space.

An electro-acoustic transducer including a housing having an interior volume with first and second interior volume portions and a sound aperture that extends to the first interior volume, a diaphragm located between the first and second interior volumes, and an environmental sensor associated with the housing and having an inlet in fluid communication with the first interior volume.

An electro-acoustic transducer including a housing having an interior volume with first and second interior volume portions and a sound aperture that extends to the first interior volume, a diaphragm located between the first and second interior volumes, and an environmental sensor associated with the housing and having an inlet in fluid communication with the first interior volume.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

In various embodiments, a method for operating a sensor is provided. The method includes intermittently generating an operating current in the sensor, generating a reactive current in the sensor when the operating current is not generated, and not generating the reactive current when the operating current is generated. A value of the reactive current is the same or approximately the same as a value of the operating current.

In various embodiments, a method for operating a sensor is provided. The method includes intermittently generating an operating current in the sensor, generating a reactive current in the sensor when the operating current is not generated, and not generating the reactive current when the operating current is generated. A value of the reactive current is the same or approximately the same as a value of the operating current.

A microphone device includes a microphone array configured to capture one or more audio objects associated with a three-dimensional sound field. The microphone array includes clusters of two or more microphone elements. Each cluster includes one or more acoustic port openings and two or more microphone elements coupled to the one or more acoustic port openings via corresponding acoustic ports. The microphone device also includes a processor coupled to the microphone array.

The present invention relates to a sound transducer assembly with a MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum. The MEMS sound transducer includes a first cavity, and the sound transducer assembly includes an ASIC electrically connected to the MEMS sound transducer. The ASIC is embedded in a first substrate, and the first MEMS sound transducer is arranged on a second substrate. The first substrate and the second substrate are electrically connected to one another, and the first cavity is at least partially formed in one of the first substrate and the second substrate.

A pre-distorted electrical excitation signal is generated for an acoustic transducer having an armature and a non-linear transfer characteristic by applying an electrical input signal (x) representative of a desired acoustic output to a computable non-linear function that is a function of the electrical input signal (x). When applied to an input of the transducer, the pre-distorted electrical excitation signal results in an improved acoustic output signal.