An apparatus includes a vibration member and a first cover disposed at a rear surface of the vibration member and including a first hole. The apparatus also includes a first vibration apparatus disposed at a rear surface of the first cover and configured to cover the first hole, the first vibration apparatus being configured to vibrate the vibration member. The apparatus additionally includes a first enclosure member disposed at the rear surface of the first cover and configured to cover the first hole and the first vibration apparatus.

A sound control system comprises a sound generating device disposed at a vehicle ceiling corresponding to a seat region of the vehicle and disposed at a sound space formed within the vehicle to correspond to the seat region, and a sound processing circuit for providing a vibration driving signal to the sound generating device, the sound generating device vibrates based on the vibration driving signal to vibrate a vibration region of the vehicle ceiling corresponding to the sound space to provide a sound to the sound space.

A vibration device can include a vibration portion; a first electrode portion disposed on a first surface of the vibration portion; and a second electrode portion disposed on a second surface of the vibration portion, in which each of the first and second electrode portions include at least one of a conductive metal particle and a carbon particle.

A manufacturing method for multiple MEMS sound transducers includes manufacturing a reconstructed wafer, separating multiple chips from the wafer, and encapsulating the chips in a molding material. A piezoelectric element of the particular chips is exposed to become deflectable along a stroke axis. The reconstructed wafer is connected to multiple diaphragms associated with the particular chips, wherein the diaphragms are each connected to the associated piezoelectric element so that the diaphragms are each deflectable together with the at least one associated piezoelectric element along the stroke axis. MEMS sound transducers, each of which including at least one of the chips and one of the diaphragms, are isolated. A MEMS sound transducer, which has been manufactured using the aforementioned manufacturing method, is also disclosed.

A disclosed vibration device comprises a first vibration generator and a first connection member disposed on a first surface of the first vibration generator. The first vibration generator may comprise a first vibration part including a plurality of inorganic material portions having a piezoelectric characteristic and an organic material portion between the plurality of inorganic material portions.

A sound-generating apparatus and a vehicle including the same are provided. A sound-generating apparatus includes: a plurality of first portions at each of first to third regions, and a plurality of second portions between the plurality of first portions, at each of the first to third regions, wherein two or more second portions, at any one region, among the first to third regions, have a cross-sectional shape that differs from a cross-sectional shape of a second portion disposed at each of the other regions, among the first to third regions.

A display apparatus includes a display panel configured to display an image and a sound generating device on a rear surface of the display panel. The sound generating device is configured to vibrate the display panel to generate sound. The sound generating device includes a first structure and a first passivation layer on one side of the first structure, at least a portion of the first passivation layer having a non-flat shape.

An audio device includes a thin film material having a capacitive property, the thin film material including an acoustic sheet having a curved shape, in which the acoustic sheet includes a first region that is actively driven by an input signal and a second region that is not actively driven by the input signal and the first region is formed in at least a part of an outside of the second region.

A vibration apparatus comprises a lower vibration structure, an upper vibration structure on the lower vibration structure, and an adhesive member between the lower vibration structure and the upper vibration structure. The lower vibration structure and the upper vibration structure are configured to generate sound waves having different frequencies.

A sound apparatus includes a piezoelectric device, a vibration member connected to the piezoelectric device, a first magnet connected to the piezoelectric device, and a second magnet facing the first magnet, which can readily realize a desired frequency characteristic.