A transducer system has 1) a MEMS transducer configured to produce an analog output signal in response to an incident acoustic signal, and 2) a modulator apparatus. The modulator apparatus includes an analog modulator configured to receive the analog output signal and produce a first digital signal as a function of the analog output signal. In addition, the modulator apparatus also has a digital converter configured to receive the first digital signal and produce a second digital signal as a function of the first digital signal. The analog modulator has an analog order while, in a corresponding manner, the digital converter has a digital order. Preferably, the digital order is higher than the analog order.

A sensor and/or transducer device having at least one bending structure including at least one piezoelectric layer in each case, using which an intermediate volume between at least two electrodes of the bending structure is at least partially filled in each case, the sensor and/or transducer device including an electronic unit, which is designed to apply at least one predefined or established actuator voltage between two of the electrodes at a time of the bending structure in such a way that a deformation of the bending structure triggered by an intrinsic stress gradient in the bending structure may be at least partially compensated for. A method for operating a sensor and/or transducer device having at least one bending structure, which includes at least one piezoelectric layer, and a method for calibrating a microphone having at least one bending structure, which includes at least one piezoelectric layer, are also described.

A sensor and/or transducer device having at least one bending structure including at least one piezoelectric layer in each case, using which an intermediate volume between at least two electrodes of the bending structure is at least partially filled in each case, the sensor and/or transducer device including an electronic unit, which is designed to apply at least one predefined or established actuator voltage between two of the electrodes at a time of the bending structure in such a way that a deformation of the bending structure triggered by an intrinsic stress gradient in the bending structure may be at least partially compensated for. A method for operating a sensor and/or transducer device having at least one bending structure, which includes at least one piezoelectric layer, and a method for calibrating a microphone having at least one bending structure, which includes at least one piezoelectric layer, are also described.

A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.

A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device comprises a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. A base structure is configured to load the laminated structure, and at least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.

A piezoelectric, poly (γ-benzyl-α,L-glutamate) (“PBLG”) planar microphone, and method for construction thereof, are disclosed. The microphone includes at least a polyester film, a piezoelectric, hot pressed poly (γ-benzyl-α,L-glutamate) (“HPPBLG”) layer, and an aluminum coating for the HPPBLG layer. The coated HPPBLG layer is coupled to the polyester film.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a cantilever sensing element including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the cantilever sensing element the cantilever sensing element divided into a plurality of cantilevers having gaps between side edges of adjacent cantilevers, and a compliant material disposed in at least a portion of the gaps between adjacent cantilevers to improve the performance of the piezoelectric microelectromechanical system microphone.