In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.

In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.

In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

Each conductor of a plurality of insulated conductors of a wiring harness extends between, and electrically connects, a corresponding terminal of a first electrical connector to either a corresponding terminal of an electrical connector jack of a plurality of electrical jacks located along the wiring harness, or to a corresponding terminal of a corresponding auscultatory sound-or-vibration sensor of the plurality of auscultatory sound-or-vibration sensors. The plurality of insulated conductors are organized in a plurality of distinct branches, each distinct branch originating either from the first electrical connector or from another portion of the wiring harness, and the locations of the plurality of distinct branches, in cooperation with the plurality of electrical jacks, if present, are implicitly suggestive of a corresponding location of the corresponding auscultatory sound-or-vibration sensor on a thorax of a test subject.

Each conductor of a plurality of insulated conductors of a wiring harness extends between, and electrically connects, a corresponding terminal of a first electrical connector to either a corresponding terminal of an electrical connector jack of a plurality of electrical jacks located along the wiring harness, or to a corresponding terminal of a corresponding auscultatory sound-or-vibration sensor of the plurality of auscultatory sound-or-vibration sensors. The plurality of insulated conductors are organized in a plurality of distinct branches, each distinct branch originating either from the first electrical connector or from another portion of the wiring harness, and the locations of the plurality of distinct branches, in cooperation with the plurality of electrical jacks, if present, are implicitly suggestive of a corresponding location of the corresponding auscultatory sound-or-vibration sensor on a thorax of a test subject.

According to one embodiment, a sensor includes a first structure body, a second structure body, and a detector. The first structure body includes a supporter, a deformable part supported by a first portion of the supporter, and a membrane part. At least a portion of the membrane part is connected to the deformable part and a second portion of the supporter. The second structure body is connected to the first structure body. A liquid is provided between the first structure body and the second structure body. The detector outputs a signal corresponding to a deformation of the deformable part.

A microphone has a MEMS device, a driver, and a control unit. The MEMS device outputs a first electrical signal according to an acoustic pressure. The driver vibrates the MEMS device by a drive signal. The control unit calculates a correction value for correcting the first electric signal based on a second electric signal output from the MEMS device when the MEMS device is vibrated by the drive signal.

The sound detection device comprises a substrate, an array of sound detectors in or on a surface of the substrate, a processing circuit coupled to the sound detectors, the processing circuit being configured to sum signals from the sound detectors with relative time delays or phase shifts that compensate for propagation delay of sound along the array in a sound propagation mode that is bound to said surface. In an embodiment the sound in said sound propagation mode is bound to the surface using an acoustic waveguide, wherein the surface of the substrate forms a part of the acoustic waveguide, the sound detection device comprising a wall facing the array of sound detectors, with a space between the surface of the substrate and the wall, the sound detection device comprising an opening that provides incoming sound from outside the device access to said space, for excitation of the wave in the bound propagation mode in the acoustic waveguide by sound from outside the device.

Various embodiments of the present disclosure are directed towards an integrated chip including a piezoelectric membrane overlying a substrate. A plurality of conductive layers is disposed within the piezoelectric membrane. The plurality of conductive layers comprises a first conductive layer over a second conductive layer. The first conductive layer comprises a first electrode and the second conductive layer comprises a second electrode. A first conductive via is disposed in the piezoelectric membrane and contacts the first electrode. A second conductive via is disposed in the piezoelectric membrane and contacts the second electrode. A sidewall of the second conductive via comprises a vertical sidewall segment overlying a slanted sidewall segment.