Provided are an ultrasound probe including high-sensitive piezoelectric elements and a method of manufacturing an ultrasound probe. The ultrasound probe includes a plurality of piezoelectric elements on a backing material arranged in an array along an arrangement direction. Each of the plurality of piezoelectric elements includes a laminate in which a first conductive part, a piezoelectric body part, and a second conductive part are laminated on a surface of the backing material in order. A plurality of acoustic matching part respectively arranged on the second conductive parts of the plurality of piezoelectric elements is provided. A plurality of third conductive parts acquired by respectively joining a part of the plurality of acoustic matching parts in an elevation direction to the second conductive parts of the plurality of piezoelectric elements is provided. A fourth conductive part that electrically connects the plurality of third conductive parts to each other is provided. The second conductive parts of the plurality of piezoelectric elements, the plurality of third conductive parts, and the fourth conductive part form a common electrode common to the plurality of piezoelectric elements.

Provided are an ultrasound probe including high-sensitive piezoelectric elements and a method of manufacturing an ultrasound probe. The ultrasound probe includes a plurality of piezoelectric elements on a backing material arranged in an array along an arrangement direction. Each of the plurality of piezoelectric elements includes a laminate in which a first conductive part, a piezoelectric body part, and a second conductive part are laminated on a surface of the backing material in order. A plurality of acoustic matching part respectively arranged on the second conductive parts of the plurality of piezoelectric elements is provided. A plurality of third conductive parts acquired by respectively joining a part of the plurality of acoustic matching parts in an elevation direction to the second conductive parts of the plurality of piezoelectric elements is provided. A fourth conductive part that electrically connects the plurality of third conductive parts to each other is provided. The second conductive parts of the plurality of piezoelectric elements, the plurality of third conductive parts, and the fourth conductive part form a common electrode common to the plurality of piezoelectric elements.

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

A disclosed vibration device comprises a first vibration generator and a first connection member disposed on a first surface of the first vibration generator. The first vibration generator may comprise a first vibration part including a plurality of inorganic material portions having a piezoelectric characteristic and an organic material portion between the plurality of inorganic material portions.

A prosthesis including an implantable component including an LC circuit, wherein a piezoelectric material forms at least a part of the capacitance portion of the LC circuit, the piezoelectric material expands and/or contracts upon the application of a variable magnetic field to the inductor of the LC circuit, the LC circuit has an electrical self-resonance frequency below 20 kHz, and the piezoelectric material forms part of an actuator configured to output a force to tissue of a recipient in which the implantable component is implanted.

A prosthesis including an implantable component including an LC circuit, wherein a piezoelectric material forms at least a part of the capacitance portion of the LC circuit, the piezoelectric material expands and/or contracts upon the application of a variable magnetic field to the inductor of the LC circuit, the LC circuit has an electrical self-resonance frequency below 20 kHz, and the piezoelectric material forms part of an actuator configured to output a force to tissue of a recipient in which the implantable component is implanted.

Disclosed are a directional acoustic sensor, a method of adjusting directional characteristics using the directional acoustic sensor, and a method of attenuating an acoustic signal in a specific direction using the directional acoustic sensor. The directional acoustic sensor includes a plurality of resonance units arranged to have different directionalities and a signal processor configured to adjust directional characteristics by calculating at least one of a sum of and a difference between outputs of the resonance units. In this state, the signal processor attenuates an acoustic signal in a specific direction by using a plurality of directional characteristics obtained by calculating at least one of the sum of and the difference between the outputs of the resonance units at a certain ratio.

Systems and methods for a transducer assembly for a vehicle having a resonating surface. The transducer assembly comprising a housing, a spacer connected to the housing, and a piezoelectric assembly disposed between the spacer and the housing. The spacer is configured to connect to the resonating surface to form an air gap between the resonating surface and the piezoelectric assembly.

Systems and methods for a transducer assembly for a vehicle having a resonating surface. The transducer assembly comprising a housing, a spacer connected to the housing, and a piezoelectric assembly disposed between the spacer and the housing. The spacer is configured to connect to the resonating surface to form an air gap between the resonating surface and the piezoelectric assembly.