A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

Disclosed are an active noise reduction acoustic unit and a sound-producing unit, the active noise reduction acoustic unit includes a casing; a baseplate which is arranged in the casing and separates the casing into a first accommodating cavity and a second accommodating cavity; the first accommodating cavity and the second accommodating cavity are in communication with each other, the second accommodating cavity being provided therein with a feedback microphone, and the feedback microphone being configured to pick up noise signals; and the first accommodating cavity is provided therein with a moving iron speaker which can vibrate and produce sound according to the noise signals.

A MEMS microphone includes a substrate, a diaphragm disposed over the substrate to cover the cavity, the diaphragm defining an air gap together with the back plate, and the diaphragm being spaced apart from the substrate, a back plate disposed over the diaphragm and in the vibration area, an upper insulation layer to cover the back plate, a plurality of chamber portions provided in the supporting area, a lower insulation layer provided under the upper insulation layer and on the substrate, and an intermediate insulation layer provided between the lower insulation layer and the upper insulation layer and disposed further from the vibration area than the chamber portions.

In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer are removed.

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

A device includes a readout circuit coupled between an input node and an output node; a microelectromechanical systems (MEMS) device coupled to the input node; and a first charge controlled clamp circuit coupled between the input node and a first bias node.

A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

A MEMS microphone includes a diaphragm disposed in a first direction, and an electrode structure disposed in the first direction and configured to surround the diaphragm and to be spaced apart from the diaphragm. The electrode structure includes electrodes spaced apart from each other in a second direction perpendicular to the first direction.