A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Microphone distortion reduction is presented herein. A system can comprise: a processor; and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, comprising: obtaining a pressure-in to voltage-out transfer function representing a distortion of an output of a microphone corresponding to a stimulus of a defined sound pressure level that has been applied to the microphone; inverting an equation representing the pressure-in to voltage-out transfer function to obtain an inverse transfer function; and applying the inverse transfer function to the output to obtain a linearized output representing the stimulus. In one example, the obtaining of the pressure-in to voltage-out transfer function comprises: creating an ideal sine wave stimulus comprising the amplitude and fundamental frequency of the time domain waveform; and generating the equation based on a defined relationship between the ideal sine wave stimulus and the time domain waveform.

A unidirectional condenser microphone unit is provided that have directionality unaffected by the external environment, and a method of manufacturing the unidirectional condenser microphone. The unidirectional condenser microphone unit having an interior and an exterior, the unidirectional condenser microphone includes a diaphragm, a fixed electrode facing the diaphragm, the fixed electrode constituting a capacitor with the diaphragm, an insulating base disposed in a back face side of the fixed electrode, the insulating base supporting the fixed electrode, an air chamber disposed in the back face side of the fixed electrode, and a gap disposed between the fixed electrode and the insulating base. The fixed electrode includes at least one sound hole in communication with the air chamber. The insulating base includes a communication hole establishing communication between the gap and the exterior of the microphone unit. The air chamber and the gap are in communication with each other.

A method and a system for ultra-low-power acoustic sensor including a buffer transistor, which gate terminal is connected to a first terminal of a capacitive acoustic sensor, which drain terminal is connected via a load network to a power source and to an output terminal, and which source terminal is connected to the regulated current source, where the regulated current source is connected between the source terminal of the buffer transistor and a reference terminal, and where the reference terminal being connectable to a second terminal of the capacitive acoustic sensor.

An electro-acoustic transducer includes: a housing, a partition member disposed inside the housing, a first electro-acoustic conversion unit, and a second electro-acoustic conversion unit. The first electro-acoustic conversion unit includes a fixed electrode, a vibrating membrane, and a support member that supports a partial region of the vibrating membrane and brings a part of the vibrating membrane in contact with the fixed electrode. The first electro-acoustic conversion unit and the second electro-acoustic conversion unit are disposed facing each other across the partition member so that a sound emitting part and a sound emitting part communicate with an acoustic outlet, and the partition member supports the support member and the support member.

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Microphone distortion reduction is presented herein. A system can comprise: a processor; and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, comprising: obtaining a pressure-in to voltage-out transfer function representing a distortion of an output of a microphone corresponding to a stimulus of a defined sound pressure level that has been applied to the microphone; inverting an equation representing the pressure-in to voltage-out transfer function to obtain an inverse transfer function; and applying the inverse transfer function to the output to obtain a linearized output representing the stimulus. In one example, the obtaining of the pressure-in to voltage-out transfer function comprises: creating an ideal sine wave stimulus comprising the amplitude and fundamental frequency of the time domain waveform; and generating the equation based on a defined relationship between the ideal sine wave stimulus and the time domain waveform.

The present invention provides a silicon microphone with a high-aspect-ratio corrugated diaphragm and a microphone package including the same. The microphone comprises the corrugated diaphragm on which at least one ring-shaped corrugation is formed in the vicinity of the edge of the diaphragm which is fixed to the substrate, the corrugated diaphragm is flexible, wherein the ratio of the depth of the corrugation to the thickness of the diaphragm is larger than 5:1, preferably 20:1, and the walls of the corrugation are inclined to the surface of the diaphragm at an angle in the range of 80 to 100. The microphone with the high-aspect-ratio corrugated diaphragm can achieve a consistent and optimal sensitivity and greatly reduce impact applied thereto in a drop test so that the performances, the reproducibility, the reliability and the yield can be improved. The microphone package of the present invention further provides a simplified processing, an improved sensitivity and an improved SNR.

Disclosed are an electrical-acoustic transformation device and an electronic device, including a moving coil electrical-acoustic transformation unit and a piezoelectric buzzer. The electrical-acoustic transformation device in the present invention has a moving coil sound generating structure and a piezoelectric sound generating structure. The piezoelectric plate compensates the high-frequency response of a vibrating system, realizing an electrical-acoustic transformation device with good performance and super wideband.

A charge pump assembly allowing MEMS microphones being temperature-compensated in a large temperature range and corresponding microphones are provided. An assembly comprises a charge pump and a bias circuit electrically connected to the charge pump. A bias voltage provided by the bias circuit has a temperature dependence.