A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

An electret condenser microphone is provided. The electret condenser microphone comprises a diaphragm, a backplate with a metal layer on the side facing the diaphragm and an amplifier on the other side, the input of the amplifier electrically connecting the metal layer, a spacer separating the diaphragm and the backplate PWB; and a metal sleeve accommodating the diaphragm, the backplate and the spacer.

A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.

An electret microphone is provided. This comprises an electrically conductive membrane, and a counter-electrode having at least one first hole having a first distance from an edge of the counter-electrode and a second plurality of second holes each having a second distance from the edge of the counter-electrode. The second distance is shorter than the first distance. The electret microphone has a first electrically conductive coating on a first side of the counter-electrode and a second electrically conductive coating on a second side of the counter-electrode. The at least one first hole comprises a via in order to electrically contact the first and second electrically conductive coating. A third distance is provided in each case between the second holes and the first electrically conductive coating so that the first electrically conductive coating does not reach as far as the second holes. The electret microphone further comprises a polarizable film which extends completely over the first electrically conductive coating and thereby leaves free the first and second holes, wherein the polarizable film extends as far as the second holes.

An musical instrument amplifier-mounted microphone assembly operatively attaches to the seal of an instrument speaker to capture sound waves, without losing unique sounds. The microphone assembly utilizes electret condenser microphones to achieve boundary layer configuration. The microphone assembly fits flush against, or parallel to, the speaker baffle that holds the microphone assembly in front of speaker cones. The microphone assembly mounts on a circuit board which acts as a reflective surface to achieve boundary layer effect. The flat circuit board provides flat conductor traces that carry audio signals from the electret assembly, past the gasket seal of the speaker, to electronics on the board that power, amplify and match impedances needed to pass the audio signal to a large venue amplification system. A connector terminal on the circuit board connects via a shielded cable to a housing mounted XLR connector that provides connection to a large venue amplification system.

An musical instrument amplifier-mounted microphone assembly operatively attaches to the seal of an instrument speaker to capture sound waves, without losing unique sounds. The microphone assembly utilizes electret condenser microphones to achieve boundary layer configuration. The microphone assembly fits flush against, or parallel to, the speaker baffle that holds the microphone assembly in front of speaker cones. The microphone assembly mounts on a circuit board which acts as a reflective surface to achieve boundary layer effect. The flat circuit board provides flat conductor traces that carry audio signals from the electret assembly, past the gasket seal of the speaker, to electronics on the board that power, amplify and match impedances needed to pass the audio signal to a large venue amplification system. A connector terminal on the circuit board connects via a shielded cable to a housing mounted XLR connector that provides connection to a large venue amplification system.

A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

An electret condenser microphone with a low noise figure and a method for producing the same are disclosed. An electret variable condenser is first installed into a housing, and then an ASIC amplifier and a printed circuit board are installed into the housing. The ASIC amplifier is electrically connected to the electret variable condenser. It reduces the noise figure effectively and ensures the normal transmission of the effective sound. In particular, it ensures the stability and reliability of the ASIC amplifier during use. The process is simple, the production efficiency is high, and the processing cost is low.

A microphone can include a cover having a series of slits and a nest. The nest can be configured to receive a first diaphragm, a second diaphragm, and a PCB in a stacked arrangement, such that the PCB is positioned between the first diaphragm and the second diaphragm. Also, the first diaphragm can define a first plane, the second diaphragm can define a second plane, and the PCB can define a third plane and the first plane, the second plane, and the third plane can extend parallel to one another. The cover can also include slits having a first length and a second length, and the first length can be greater than the second length. The slits can extend both radially and axially.