A package includes a base structure, which has an electrically isolating material and/or an electrically conductive contact structure, an electronic component, which is embedded in the base structure or is arranged on the base structure, a microelectromechanical system (MEMS) component, and a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.

A package includes a base structure, which has an electrically isolating material and/or an electrically conductive contact structure, an electronic component, which is embedded in the base structure or is arranged on the base structure, a microelectromechanical system (MEMS) component, and a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.

A transparent ultrasonic emitter includes a first transparent conductive layer; a second transparent conductive layer; and a plurality of transparent spacers disposed between the first and second transparent layers conductive of the ultrasonic audio speaker, the transparent spacers having a thickness and being arranged to define an open area between the first and second transparent layers.

A transparent ultrasonic emitter includes a first transparent conductive layer; a second transparent conductive layer; and a plurality of transparent spacers disposed between the first and second transparent layers conductive of the ultrasonic audio speaker, the transparent spacers having a thickness and being arranged to define an open area between the first and second transparent layers.

Provided is a PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate; providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate; providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer; and releasing the sacrificial layer and the diaphragm layer remains. With the micromachining method for the above PCB substrate and the diaphragm, the production cost of the speaker can be lowered, and the reliability of the product can be improved at the same time.

Provided is a PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate; providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate; providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer; and releasing the sacrificial layer and the diaphragm layer remains. With the micromachining method for the above PCB substrate and the diaphragm, the production cost of the speaker can be lowered, and the reliability of the product can be improved at the same time.

A loudspeaker assembly may be configured with at least one driver disposed between first and second acoustic impedance structures. The first and second impedance structures can be arranged with one or more layers that have similar, or dissimilar, thicknesses. The first and second impedance structures can respectively be configured to maintain symmetric acoustic impedance on opposite sides of the driver during operation of the driver.

An acoustic device (1), comprises: a container (2); a passive resonator, including a suspension (3) connected to the container (2) and a radiator (4) connected to the suspension (3), where the suspension (3) is configured to allow the radiator (4) to vibrate relative to the container (2), a structure (5) having at least a first connecting point (51), where it is connected to the radiator (4), and a second connecting point (52), where it is connected to the container (2), the structure (5) being movable alternately between a first position and a second position, responsive to a vibration of the radiator (4); one or more masses (61, 62), spaced from the radiator (4) and associated with the vibrating structure (5).

An acoustic device (1), comprises: a container (2); a passive resonator, including a suspension (3) connected to the container (2) and a radiator (4) connected to the suspension (3), where the suspension (3) is configured to allow the radiator (4) to vibrate relative to the container (2), a structure (5) having at least a first connecting point (51), where it is connected to the radiator (4), and a second connecting point (52), where it is connected to the container (2), the structure (5) being movable alternately between a first position and a second position, responsive to a vibration of the radiator (4); one or more masses (61, 62), spaced from the radiator (4) and associated with the vibrating structure (5).

A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a carrier: a diaphragm connected to and deflectable with respect thereto the carrier and a piezoelectric element spaced apart from the diaphragm along a reciprocation axis. The piezoelectric element includes a coupling element that extends along the reciprocation axis and connects to the diaphragm. The piezoelectric element and the coupling element form a cantilever. The MEMS sound transducer includes two cantilever arms are arranged one behind the other, in a top view.