This disclosure provides systems, methods, and apparatus related to acoustic transducers.

The present invention is a signal processing circuit 12 for an electrostatic electroacoustic transducer configured to correct signals input to a single driven electrostatic electroacoustic transducer 15 including a diaphragm 151 and a fixed electrode 152 disposed to face the diaphragm. The signal processing circuit includes a correction value determiner 122 configured to determine a correction value v1 of a level based on a level of the input signals s1 from the sound source, and a level corrector 124 configured to correct the level of the input signals based on the correction value. The level corrector is configured to correct the level of an input signal among the input signals based on the correction value. The input signal corresponds to a signal for displacing the diaphragm to a first direction side on which a fixed electrode is not disposed with respect to a predetermined position.

The present invention is a signal processing circuit 12 for an electrostatic electroacoustic transducer configured to correct signals input to a single driven electrostatic electroacoustic transducer 15 including a diaphragm 151 and a fixed electrode 152 disposed to face the diaphragm. The signal processing circuit includes a correction value determiner 122 configured to determine a correction value v1 of a level based on a level of the input signals s1 from the sound source, and a level corrector 124 configured to correct the level of the input signals based on the correction value. The level corrector is configured to correct the level of an input signal among the input signals based on the correction value. The input signal corresponds to a signal for displacing the diaphragm to a first direction side on which a fixed electrode is not disposed with respect to a predetermined position.

An improved loudspeaker system that produces an improved audio quality for stereophonic sound, which can be described as 3D audio. In one embodiment, the improved loudspeaker utilizes at least three stacks of electrostatic transducer cards, with one of the stacks located between the other two stacks. While there is generally some crossover between the frequencies of the stacks of electrostatic transducers, the middle stack will be directed to the lower frequency ranges and the other two stacks will be directed to the higher frequency ranges. Each of the three card stacks will utilize multi-track audio recordings, such as two-track audio recordings, which are modified for each of the three card stacks. In an alternative embodiment, the improved loudspeaker can utilize a conventional voice-coil driver in lieu of the middle stack of electrostatic transducer cards.

An improved loudspeaker system that produces an improved audio quality for stereophonic sound, which can be described as 3D audio. In one embodiment, the improved loudspeaker utilizes at least three stacks of electrostatic transducer cards, with one of the stacks located between the other two stacks. While there is generally some crossover between the frequencies of the stacks of electrostatic transducers, the middle stack will be directed to the lower frequency ranges and the other two stacks will be directed to the higher frequency ranges. Each of the three card stacks will utilize multi-track audio recordings, such as two-track audio recordings, which are modified for each of the three card stacks. In an alternative embodiment, the improved loudspeaker can utilize a conventional voice-coil driver in lieu of the middle stack of electrostatic transducer cards.

This invention relates to a microelectromechanical loudspeaker implemented as a system-on-chip or system-in-package. The microelectromechanical loudspeaker includes a microelectromechanical sound-generating device implemented in a microelectromechanical system (MEMS) and a microphone mounted on the cover or integrated in the cover, wherein the microphone is positioned adjacent to one of the sound outlet openings of the cover. The MEMS comprises a cavity formed between a planar cover, a planar base and circumferential sidewalls provided between the cover and the base. The MEMS further comprises a plurality of movable actuators for generating sound. The actuators are provided in the cavity between the cover and the base, and wherein the cover and the base have a plurality of sound outlet openings to emit sound in a direction transverse to the cover and the base, respectively.

This invention relates to a microelectromechanical loudspeaker implemented as a system-on-chip or system-in-package. The microelectromechanical loudspeaker includes a microelectromechanical sound-generating device implemented in a microelectromechanical system (MEMS) and a microphone mounted on the cover or integrated in the cover, wherein the microphone is positioned adjacent to one of the sound outlet openings of the cover. The MEMS comprises a cavity formed between a planar cover, a planar base and circumferential sidewalls provided between the cover and the base. The MEMS further comprises a plurality of movable actuators for generating sound. The actuators are provided in the cavity between the cover and the base, and wherein the cover and the base have a plurality of sound outlet openings to emit sound in a direction transverse to the cover and the base, respectively.

A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.