Patent classifications
H04R19/04
MEMS MICROPHONE
An MEMS microphone includes a substrate including a back volume provided inside the substrate and an opening provided at an upper surface of the substrate to communicate the back volume; a sensing device provided at an inner side wall of the back volume; a first cantilever provided inside the back volume and including end portions coupling with the sensing device; a first membrane provided at the opening; a second membrane provided inside the back volume; and second cantilevers, each of which includes a first end mechanically supporting the first cantilever, and a second end connected to the second membrane. By suspending the first cantilever on the second cantilevers, the end portions of the first cantilever always couple with a preset position of the sensing device. Thus, the DC offset of the displacement of the membrane can be prevented.
MEMS MICROPHONE
An MEMS microphone includes a substrate including a back volume provided inside the substrate and an opening provided at an upper surface of the substrate to communicate the back volume; a sensing device provided at an inner side wall of the back volume; a first cantilever provided inside the back volume and including end portions coupling with the sensing device; a first membrane provided at the opening; a second membrane provided inside the back volume; and second cantilevers, each of which includes a first end mechanically supporting the first cantilever, and a second end connected to the second membrane. By suspending the first cantilever on the second cantilevers, the end portions of the first cantilever always couple with a preset position of the sensing device. Thus, the DC offset of the displacement of the membrane can be prevented.
MICROPHONE
A microphone has a MEMS device, a driver, and a control unit. The MEMS device outputs a first electrical signal according to an acoustic pressure. The driver vibrates the MEMS device by a drive signal. The control unit calculates a correction value for correcting the first electric signal based on a second electric signal output from the MEMS device when the MEMS device is vibrated by the drive signal.
MICROPHONE
A microphone has a MEMS device, a driver, and a control unit. The MEMS device outputs a first electrical signal according to an acoustic pressure. The driver vibrates the MEMS device by a drive signal. The control unit calculates a correction value for correcting the first electric signal based on a second electric signal output from the MEMS device when the MEMS device is vibrated by the drive signal.
MICROELECTROMECHANICAL SYSTEMS (MEMS) SWITCH AND RELATED METHODS
Microelectromechanical systems (MEMS) switches are disclosed. The MEMS switch may have an actuation voltage greater than the expected voltage of a signal being passed by the MEMS switch in normal operation. The MEMS switches may include a distributed hinge structure in some embodiments. Radial contact pads are included in some embodiments, with or separate from the distributed hinge.
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VIBRATION SENSOR AND FABRICATING METHOD THEREOF
A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.
Microphone and manufacture thereof
A microphone and its manufacturing method, relating the semiconductor techniques, are presented. The microphone comprises: a substrate comprising an opening, a first electrode layer at the bottom of the opening, and at least one groove adjacent to the first electrode layer, with the groove and the opening on two opposing sides of a bottom surface of the first electrode layer; a separation material layer filling the groove; and a second electrode layer on the separation material layer, wherein the first electrode layer, the separation material layer, and the second electrode layer form a cavity. In this inventive concept, the separation material layer on the groove works as an anchor node embedding in the substrate to increases the effective contact area and the bonding power, and to improve the bonding quality between the second electrode layer and the substrate, which results in a strengthened second electrode layer.
Microphone and manufacture thereof
A microphone and its manufacturing method, relating the semiconductor techniques, are presented. The microphone comprises: a substrate comprising an opening, a first electrode layer at the bottom of the opening, and at least one groove adjacent to the first electrode layer, with the groove and the opening on two opposing sides of a bottom surface of the first electrode layer; a separation material layer filling the groove; and a second electrode layer on the separation material layer, wherein the first electrode layer, the separation material layer, and the second electrode layer form a cavity. In this inventive concept, the separation material layer on the groove works as an anchor node embedding in the substrate to increases the effective contact area and the bonding power, and to improve the bonding quality between the second electrode layer and the substrate, which results in a strengthened second electrode layer.
Sensor with a membrane electrode, a counterelectrode, and at least one spring
A sensor includes a membrane electrode, a counter-electrode, and at least one spring. The sensor can include a structure; a membrane electrode, which is deformable as a consequence of pressure and which is in contact with the structure; a counter-electrode mechanically connected to the structure and separated from the membrane electrode by a gap; and at least one spring mechanically connected to the membrane electrode and the counter-electrode, so as to exert an elastic force between the membrane electrode and the counter-electrode.
Sensor with a membrane electrode, a counterelectrode, and at least one spring
A sensor includes a membrane electrode, a counter-electrode, and at least one spring. The sensor can include a structure; a membrane electrode, which is deformable as a consequence of pressure and which is in contact with the structure; a counter-electrode mechanically connected to the structure and separated from the membrane electrode by a gap; and at least one spring mechanically connected to the membrane electrode and the counter-electrode, so as to exert an elastic force between the membrane electrode and the counter-electrode.