Patent classifications
H04R19/04
Charge pump and microphone circuit arrangement
A charge pump having an input section, and first and second output charge pump sections. The input section includes an input and output node and N input charge pump cells arranged between the input and output nodes. The first output charge pump section includes a first input and output node and M first charge pump cells arranged between the first input and output nodes. The second output charge pump section includes a second input and output node and K second charge pump cells arranged between the second input and output nodes (M, N, K: any integer≥1). The output node of the input charge pump section is coupled with the first input node of the first output charge pump section and with the second input node of the second output charge pump section. The charge pump is configured to provide a first output voltage on the first output node and a second output voltage on the second output node.
Microphone, and intelligent voice device
Embodiments of the present disclosure provide a microphone and an intelligent voice device. The microphone includes a housing, a diaphragm, a primary sound pickup component, and a secondary sound pickup component. The diaphragm is configured to output an electric signal according to a sound pressure acting on the first sound pickup surface and the second sound pickup surface. The primary sound pickup component is formed on the housing, and configured to transmit a sound wave from outside of the housing to the first sound pickup surface through a primary sound pickup channel at a first sound pressure. The secondary sound pickup component is formed on the housing, and configured to transmit the sound wave to the second sound pickup surface through a secondary sound pickup channel at a second sound pressure, the secondary sound pickup channel being different from the first sound pressure.
Microphone, and intelligent voice device
Embodiments of the present disclosure provide a microphone and an intelligent voice device. The microphone includes a housing, a diaphragm, a primary sound pickup component, and a secondary sound pickup component. The diaphragm is configured to output an electric signal according to a sound pressure acting on the first sound pickup surface and the second sound pickup surface. The primary sound pickup component is formed on the housing, and configured to transmit a sound wave from outside of the housing to the first sound pickup surface through a primary sound pickup channel at a first sound pressure. The secondary sound pickup component is formed on the housing, and configured to transmit the sound wave to the second sound pickup surface through a secondary sound pickup channel at a second sound pressure, the secondary sound pickup channel being different from the first sound pressure.
MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system
A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.
MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system
A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.
HEADPHONE AND ELECTRONIC DEVICE
A headphone and an electronic device are provided. The headphone includes a gyroscope, which senses a bone conduction vibration and provides a quadrature error signal for reflecting the bone conduction vibration. Specifically, the headphone includes a transmission assembly that acts directly or indirectly on the gyroscope or an inertial measurement unit (IMU) including the gyroscope. The transmission assembly transmits the bone conduction vibration to the gyroscope to make the gyroscope strain, thereby causing the quadrature error signal of the gyroscope to change to detect the bone conduction vibration with sensitivity.
ACOUSTIC BAND-PASS FILTER ASSEMBLIES, WIRELESS BLOCKAGE MONITORS, AND RELATED METHODS
An acoustic band-pass filter assembly includes an inlet, a microphone configured to receive acoustic energy from the inlet, and a plurality of resonator chambers disposed in series between the inlet and the microphone and configured to transmit acoustic energy between the inlet and the microphone. Each of the plurality of resonator chambers has a different cross-sectional area.
Intrinsic-stress self-compensated microelectromechanical systems transducer
A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.
Intrinsic-stress self-compensated microelectromechanical systems transducer
A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.
Microelectromechanical Sound Transducer System
This invention relates to a microelectromechanical loudspeaker implemented as a system-on-chip or system-in-package. The microelectromechanical loudspeaker includes a microelectromechanical sound-generating device implemented in a microelectromechanical system (MEMS) and a microphone mounted on the cover or integrated in the cover, wherein the microphone is positioned adjacent to one of the sound outlet openings of the cover. The MEMS comprises a cavity formed between a planar cover, a planar base and circumferential sidewalls provided between the cover and the base. The MEMS further comprises a plurality of movable actuators for generating sound. The actuators are provided in the cavity between the cover and the base, and wherein the cover and the base have a plurality of sound outlet openings to emit sound in a direction transverse to the cover and the base, respectively.