This invention relates to a microelectromechanical loudspeaker implemented as a system-on-chip or system-in-package. The microelectromechanical loudspeaker includes a microelectromechanical sound-generating device implemented in a microelectromechanical system (MEMS) and a microphone mounted on the cover or integrated in the cover, wherein the microphone is positioned adjacent to one of the sound outlet openings of the cover. The MEMS comprises a cavity formed between a planar cover, a planar base and circumferential sidewalls provided between the cover and the base. The MEMS further comprises a plurality of movable actuators for generating sound. The actuators are provided in the cavity between the cover and the base, and wherein the cover and the base have a plurality of sound outlet openings to emit sound in a direction transverse to the cover and the base, respectively.

The invention provides a diaphragm and a preparation method thereof, and an MEMS microphone. The diaphragm includes a intermediate vibration part and a fixed part surrounding the vibration part. The vibration part includes multiple vibration sub-parts, which are distributed stepwise along the vibration direction of the diaphragm. Multiple vibration sub-parts are distributed stepwise along the vibration direction of diaphragm. The effective area of the diaphragm is increased, and the stress can be adjusted by the height of the ladder and its inclination angle. The mechanical sensitivity of the MEMS microphone containing this diaphragm is improved, resulting in a high-performance, small-sized MEMS microphone.

The invention provides a diaphragm and a preparation method thereof, and an MEMS microphone. The diaphragm includes a intermediate vibration part and a fixed part surrounding the vibration part. The vibration part includes multiple vibration sub-parts, which are distributed stepwise along the vibration direction of the diaphragm. Multiple vibration sub-parts are distributed stepwise along the vibration direction of diaphragm. The effective area of the diaphragm is increased, and the stress can be adjusted by the height of the ladder and its inclination angle. The mechanical sensitivity of the MEMS microphone containing this diaphragm is improved, resulting in a high-performance, small-sized MEMS microphone.

One of the main objects of the present invention is to provide a silicon microphone that is reasonably designed and can effectively improve electroacoustic performance. To achieve the above-mentioned objects, the present invention provides a silicon microphone including a substrate with a back cavity; and a capacitor system attached to and insulated from the substrate. The capacitor system includes a diaphragm and a back plate spaced from the diaphragm. At least one through hole is formed in the back plate. The diaphragm includes a vibration part in a middle thereof and a fixed part surrounding and spaced from the vibration part by a first slit. An orthographic projection of the vibration part on the substrate partially overlaps with the substrate thereby forming a second slit between the vibration part and the substrate and communicating with the first slit and the back cavity, respectively.

One of the main objects of the present invention is to provide a silicon microphone that is reasonably designed and can effectively improve electroacoustic performance. To achieve the above-mentioned objects, the present invention provides a silicon microphone including a substrate with a back cavity; and a capacitor system attached to and insulated from the substrate. The capacitor system includes a diaphragm and a back plate spaced from the diaphragm. At least one through hole is formed in the back plate. The diaphragm includes a vibration part in a middle thereof and a fixed part surrounding and spaced from the vibration part by a first slit. An orthographic projection of the vibration part on the substrate partially overlaps with the substrate thereby forming a second slit between the vibration part and the substrate and communicating with the first slit and the back cavity, respectively.

A microphone assembly can include a microelectromechanical systems (MEMS) transducer comprising a transducer substrate, a diaphragm oriented substantially parallel to the transducer substrate and spaced apart from the transducer substrate to form a gap, and a counter electrode coupled to the transducer substrate, the counter electrode positioned between the diaphragm and the transducer substrate. The MEMS transducer can generate a signal representative of a change in capacitance between the counter electrode and the diaphragm. A back volume of the MEMS transducer can be an enclosed volume positioned between the transducer substrate and the diaphragm. The microphone assembly can include an integrated circuit that receives the signal, wherein every point within the back volume is less than a thermal boundary layer thickness from a nearest solid surface at an upper limit of an audio frequency band that the integrated circuit is monitoring.

Programming time delay data in an oversampled sensor includes determining whether to enter Programming Mode based on a value of a system parameter received by the oversampled sensor. Programming Mode is entered when the value of the system parameter corresponds to Programming Mode. The time delay data is programmed in the oversampled sensor during Programming Mode. The oversampled sensor uses the time delay data to time delay its output in an oversampled domain. Programming Mode is exited after a predetermined time has expired relative to when Programming Mode was entered. The system parameter can be a frequency of a sampling clock signal.

Programming time delay data in an oversampled sensor includes determining whether to enter Programming Mode based on a value of a system parameter received by the oversampled sensor. Programming Mode is entered when the value of the system parameter corresponds to Programming Mode. The time delay data is programmed in the oversampled sensor during Programming Mode. The oversampled sensor uses the time delay data to time delay its output in an oversampled domain. Programming Mode is exited after a predetermined time has expired relative to when Programming Mode was entered. The system parameter can be a frequency of a sampling clock signal.

The present invention provides a general MEMS device having a pair of quadrilateral insert and trench. An air channel/space includes a first internal wall and a second internal wall for air to flow between. A quadrilateral trench is recessed from the first internal wall, and a quadrilateral insert is extended from the second internal wall and inserted into the trench. In capacitive MEMS microphone, the spatial relationship between the insert and the trench can vary or oscillate. The quadrilateral insert & trench serve as an air flow restrictor or a leakage prevention structure which keeps the sound frequency response plot of the microphone flatter in the range of 20 Hz to 1000 Hz. The level of the air resistance may be controlled e.g. by the depth of quadrilateral trench/slot etched on the substrate.

Provided is a sensor package with an integrated circuit embedded in a substrate and a sensor die on the substrate. The substrate includes a molding compound that has additives configured to respond to a laser. The integrated circuit is embedded in the molding compound. An opening is through the substrate and is aligned with the sensor die. A lid covers the sensor die and the substrate, forming a cavity. At least one trace is formed on a first surface of the substrate, on an internal sidewall of the opening and on a second surface of the substrate with a laser direct structuring process.