In an embodiment, a semiconductor package includes a support and a stack of two or more semiconductor dies, the stack including an upper die and further including a lower die attached to the support by adhesive on a backside of the lower die, wherein the adhesive covers only part of the backside of the lower die, and wherein the adhesive has a plurality of non-contiguous regions on the backside of the lower die.

A microphone 12 joined by a support means 16 to a case 14 which communicates speech into light displayed through a transparent case top 10. The support mean is made of a sufficiently flexible material so it functions as a clasp repeatedly without fracturing. The support means 16 can be molded construction or pieces 20, 22, 32 joined with adhesive, pressure, heat, fasteners or other means. The case top 10 is made of a transparent material. In addition, the case may receive case tops via tabs 48 and tab holes 50, adhesive or fasteners such through holes 44 and onto supports 46.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

The present disclosure relates in a first aspect to a method of detecting leakage current from a DC bias voltage circuit of an integrated circuit for a capacitive microelectro mechanical systems (MEMS) transducer. A test signal with a predetermined frequency and level is superimposed on a first DC bias voltage generated by the DC bias voltage circuit.

The present disclosure relates in a first aspect to a method of detecting leakage current from a DC bias voltage circuit of an integrated circuit for a capacitive microelectro mechanical systems (MEMS) transducer. A test signal with a predetermined frequency and level is superimposed on a first DC bias voltage generated by the DC bias voltage circuit.

The present invention provides a capacitive microphone including a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to a fixed backplate, instead of moving toward/from the fixed backplate. The fixed backplate includes an electrical insulator sandwiched between two sub-conductors to cancel systematic/background noise. The squeeze film damping is substantially avoided, and the performance, such as signal to noise ratio, of the microphone is significantly improved.

The present invention provides a capacitive microphone including a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to a fixed backplate, instead of moving toward/from the fixed backplate. The fixed backplate includes an electrical insulator sandwiched between two sub-conductors to cancel systematic/background noise. The squeeze film damping is substantially avoided, and the performance, such as signal to noise ratio, of the microphone is significantly improved.

In accordance with one aspect of the disclosure, an electronic device comprises a plate at least partially forming one surface of a housing and including a first through-hole; a printed circuit board disposed in the housing under the plate, the printed circuit having a second through-hole at least partly overlapping the first through-hole when viewed from above the first surface; a microphone disposed on a surface of the printed circuit board facing away from the plate, and at least partly overlapping the second through-hole when viewed from above the first surface; a seal member that is disposed between the plate and the printed circuit board around the first through-hole or the second through-hole; a support member that includes a first portion that faces the printed circuit board and includes an opening, the opening penetrated by the microphone, and a second portion that extends from the first portion and faces the plate; a first fixture the printed circuit board and the first portion; and a second fixture that is disposed between the plate and the second portion.

An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.

Embodiments include a planar microphone array comprising a first linear array arranged along a first axis; and a second linear array arranged along a second axis orthogonal to the first axis, a center of the second linear array aligned with a center of the first linear array, wherein each of the first linear array and the second linear array comprises a corresponding first set of microphone elements nested within a corresponding second set of microphone elements, and each set of microphone elements is arranged symmetrically about the center of the corresponding linear array, such that the first linear array and the second linear array are configured to generate a steerable directional polar pattern, the microphone elements of each linear array configured to capture audio signals. Embodiments also include a microphone system comprising the same and a method performed by processor(s) to generate an output signal for the same.