Certain embodiments provide a hearing test probe apparatus including a hearing test probe, an eartip, and a microphone. The probe includes a speaker disposed within a probe body, and a mounting stem extending from the probe body and including a speaker sound channel. The eartip is detachably coupled to the mounting stem, and includes an eartip body having an ear insertion end and a probe insertion end opposite the ear insertion end. The eartip body defines a central opening extending from the ear insertion end to the probe insertion end. The central opening includes an eartip sound channel at the ear insertion end and an eartip mounting portion at the probe insertion end. The eartip mounting portion is configured to receive and hold the mounting stem of the probe within the central opening. The microphone is disposed within the eartip when the eartip is detachably coupled to the mounting stem.

A microphone assembly for a vehicle headliner includes a housing arranged to be received within a substrate layer of the headliner and having an upper portion and a lower portion. A circuit board is mounted in the upper portion and has a microphone element coupled thereto. An insert bracket includes a base and a shaft member extending upwardly therefrom, the base having a plurality of apertures aligned with the shaft member, wherein the shaft member engages the lower portion to connect the insert bracket to the housing. A sealing gasket having at least one channel defining an air path extending therethrough is arranged to be received within the shaft member and extend between the base and the upper portion, providing acoustic sealing between the insert bracket and the housing such that the air path directs sound from a cabin of the vehicle through the apertures to the microphone element.

A remote control with a microphone subsystem comprising a pair of internal microphones is shown and described. When connected to a remote-control base station that is itself connected to an external power source, the microphone subsystem is continuously energized by the external power source, and the pair of internal microphones operate as far field microphones that receive oral commands uttered by a user from a distance. When the remote control is removed from the base, the microphone subsystem is configured for selective connection to an internal power source by actuating a user control on the remote control. In the external power source mode, signals from both microphones are digitally processed to provide a far-field microphone array with beam forming. In the direct current mode, only one microphone's signals are digitally processed as a simple monaural signal (or they are not digitally processed). The remote control also includes a video camera capable of capturing video image data of the user and transmitting it to an associated television for facial recognition of the user.

A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.

A method for manufacturing an electroacoustic transducer includes a frame; an element moveable with respect to the frame, the moveable element including a membrane and a structure for rigidifying the membrane; a first transmission arm, the moveable element being coupled to an end of the first transmission arm; wherein a shield is used to protect the rigidification structure during a step of etching a substrate, the etching of the substrate making it possible to delimit the first transmission arm and to lighten the moveable element.

Disclosed herein is a MEMS ASIC. In some examples, the MEMS ASIC can include a MEMS, an analog front end (AFE) amplifier, an analog-to-digital converter (ADC), an overload detector, and a high-ohmic (HO) block. The HO block and the MEMS can form a high-pass filter (HPF). The impedance of the HO block can be related to the DC operating level of the AFE amplifier and the cutoff frequency of the HPF. In some examples, an overload event can occur, and the overload detector can be configured to adjust the impedance of the HO block to reduce the settling time of the MEMS ASIC. Methods of using the MEMS ASIC to reduce the settling time of the MEMS ASIC due to an overload event are disclosed herein.

Disclosed herein is a MEMS ASIC. In some examples, the MEMS ASIC can include a MEMS, an analog front end (AFE) amplifier, an analog-to-digital converter (ADC), an overload detector, and a high-ohmic (HO) block. The HO block and the MEMS can form a high-pass filter (HPF). The impedance of the HO block can be related to the DC operating level of the AFE amplifier and the cutoff frequency of the HPF. In some examples, an overload event can occur, and the overload detector can be configured to adjust the impedance of the HO block to reduce the settling time of the MEMS ASIC. Methods of using the MEMS ASIC to reduce the settling time of the MEMS ASIC due to an overload event are disclosed herein.

A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer and a connecting portion. The diaphragm is disposed between the substrate and the back plate and includes a vibration portion. The dielectric layer is formed between the substrate and the diaphragm and has a cavity corresponding to the vibrating portion. The connecting portion is located in the cavity and connects the vibrating portion and the substrate.

A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer and a connecting portion. The diaphragm is disposed between the substrate and the back plate and includes a vibration portion. The dielectric layer is formed between the substrate and the diaphragm and has a cavity corresponding to the vibrating portion. The connecting portion is located in the cavity and connects the vibrating portion and the substrate.

The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.