The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

The present disclosure provides a vibration sensor. The vibration sensor may include a vibration receiver and an acoustic transducer. The vibration receiver may include a housing, a limiter and a vibration unit. The housing and the acoustic transducer may form an acoustic cavity. The vibration unit may be located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The housing may be configured to generate a vibration based on an external vibration signal. The vibration unit may change an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal. The vibration unit may include a mass element and an elastic element. A first side of the elastic element may be connected around a side wall of the mass element. A second side of the elastic element may be connected with the limiter.

Array microphone systems and methods having adjustable lobe shapes are provided. The lobe shapes of pickup patterns in an array microphone may be adjusted by weighting the audio signals of subsets of the microphone elements that make up the array. The lobe shapes may be adjusted in a direction independent of a steering vector of the lobe. Users may have greater control of lobes which can result in more efficient and optimal coverage of audio sources in environments.

Array microphone systems and methods having adjustable lobe shapes are provided. The lobe shapes of pickup patterns in an array microphone may be adjusted by weighting the audio signals of subsets of the microphone elements that make up the array. The lobe shapes may be adjusted in a direction independent of a steering vector of the lobe. Users may have greater control of lobes which can result in more efficient and optimal coverage of audio sources in environments.

A microphone adaptor comprises a body having a first end, a second end, and an opening extending from the first end to the second end. The second end is in communication with an electro-acoustic driver. A coupling mechanism is at the first end of the body for receiving a sensing microphone and securing the microphone against the body at a predetermined fixed distance from the electro-acoustic driver.

A microphone adaptor comprises a body having a first end, a second end, and an opening extending from the first end to the second end. The second end is in communication with an electro-acoustic driver. A coupling mechanism is at the first end of the body for receiving a sensing microphone and securing the microphone against the body at a predetermined fixed distance from the electro-acoustic driver.

A method of manufacturing a microelectromechanical component, the method may include: forming a mask over a layer, the mask comprising a structured surface; heating a region of the mask comprising the structured surface above a glass transition temperature of the mask to smooth out edges of the structured surface to form a corrugated surface; etching the layer covered by the mask, the etching removing the mask to carry over the corrugated surface of the mask into the layer and to form a corrugated surface of the layer; forming a diaphragm over the layer to form a corrugated region of the diaphragm configured to actuate; and forming an electrically-conductive component configured to at least one of: provide a force to actuate the diaphragm in response to an electrical signal transmitted to the electrically-conductive component and provide an electrical signal in response to an actuation of the diaphragm.