H04R19/04

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
20170359648 · 2017-12-14 ·

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
20170359648 · 2017-12-14 ·

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.

SENSOR AMPLIFIER ARRANGEMENT AND METHOD OF AMPLIFYING A SENSOR SIGNAL
20170359036 · 2017-12-14 ·

A sensor amplifier arrangement includes an amplifier having a signal input to receive a sensor signal and a signal output, and a feedback path that couples the signal output to the signal input, wherein the feedback path includes an anti-parallel circuit of diodes, and a voltage divider including a first and a second divider resistor and a voltage divider tap between the first and the second divider resistor, wherein the voltage divider couples the signal output to a reference potential terminal, and the voltage divider tap is coupled to the anti-parallel circuit of diodes and the anti-parallel circuit of diodes is coupled to the signal input.

Acoustic transducer

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Acoustic transducer

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

DIFFERENTIAL CONDENSER MICROPHONE
20230199407 · 2023-06-22 ·

A differential condenser microphone is provided, including: a base having a cavity passing through the base; a diaphragm connected to the base and covering the cavity; a mounting portion connected to the diaphragm through a connector, movable electrodes protruding from an outer edge of the mounting portion; first fixed electrodes connected to the base, the first fixed electrodes and the movable electrodes are spatially separated from and cross each other; second fixed electrodes connected to the base, the second fixed electrodes and the movable electrodes are separated from and cross each other, and the first fixed and second fixed electrodes are arranged opposite to and spaced from each other along vibration direction of the diaphragm. Compared to the related art, the microphone can achieve higher sensitivity, higher signal-to-noise ratio, better capacity in suppressing linear distortion, and improve anti-interference capacity, thereby achieving longer signal transmission distance and better audio performance.

DIFFERENTIAL CONDENSER MICROPHONE
20230199407 · 2023-06-22 ·

A differential condenser microphone is provided, including: a base having a cavity passing through the base; a diaphragm connected to the base and covering the cavity; a mounting portion connected to the diaphragm through a connector, movable electrodes protruding from an outer edge of the mounting portion; first fixed electrodes connected to the base, the first fixed electrodes and the movable electrodes are spatially separated from and cross each other; second fixed electrodes connected to the base, the second fixed electrodes and the movable electrodes are separated from and cross each other, and the first fixed and second fixed electrodes are arranged opposite to and spaced from each other along vibration direction of the diaphragm. Compared to the related art, the microphone can achieve higher sensitivity, higher signal-to-noise ratio, better capacity in suppressing linear distortion, and improve anti-interference capacity, thereby achieving longer signal transmission distance and better audio performance.

Direction finding system using MEMS sound sensors

Provided is a Direction Finding Acoustic Sensor comprising a first sound sensor and a second sound sensor, where the first and second sound sensors are generally maintained in a reflectional symmetry around an axis of symmetry. A digital device in data communication both sound sensors receives a signal P.sub.L from the first sensor a signal P.sub.R from the second sensor based on displacement respective sensors. The digital device evaluates a difference between an α.sub.1P.sub.L and an α.sub.2P.sub.R relative to a sum of the α.sub.1P.sub.L and the α.sub.2P.sub.R, and provides an angle θ.sub.S corresponding to the result. Typically, the Direction Finding Acoustic Sensor communicates the θ.sub.s determined using some appropriate reference frame, such as the axis of symmetry. The Direction Finding Acoustic Sensor is capable of providing an unambiguous direction within an angle of ±(90°−θ.sub.off) of the axis of symmetry.

MICROPHONE
20170353803 · 2017-12-07 ·

Embodiments of the present invention provide a microphone, including: a metal cover and a printed circuit board PCB that is connected to the metal cover and that is provided with a sound pickup hole, and further including a boss that is provided with a through hole, where the boss is disposed on a side, away from the metal cover, of the PCB, and the boss is located on a soldering pad surrounding the sound pickup hole, so as to prevent soldering tin and a solder flux from entering the sound pickup hole, and the through hole is in communication with the sound pickup hole, so that an audio signal enters the sound pickup hole through the through hole.

MICROPHONE
20170353803 · 2017-12-07 ·

Embodiments of the present invention provide a microphone, including: a metal cover and a printed circuit board PCB that is connected to the metal cover and that is provided with a sound pickup hole, and further including a boss that is provided with a through hole, where the boss is disposed on a side, away from the metal cover, of the PCB, and the boss is located on a soldering pad surrounding the sound pickup hole, so as to prevent soldering tin and a solder flux from entering the sound pickup hole, and the through hole is in communication with the sound pickup hole, so that an audio signal enters the sound pickup hole through the through hole.