According to a first aspect of the embodiments, a microphone mixer is provided comprising: an input adapted to receive differential microphone (mic) output signals; a gain-trim circuit adapted to receive the differential mic output signals, and which includes a substantially fully differential amplifier adapted to amplify the received differential mic output signals through use of a gain-trim output adjustment device that provides a variable gain amount ranging from a first gain-trim gain value to a second gain-trim gain value, to produce differential gain-trim circuit output signals; a fader circuit adapted to receive the differential gain-trim circuit output signals, and which includes a differential amplifier adapted to attenuate the received differential gain-trim circuit output signals through use of a fader output adjustment device that provides a variable gain amount ranging from a first fader gain value to a second fader value; and a common adjustment apparatus that mechanically ties the gain-trim output adjustment device with the fader output adjustment device such that the first gain-trim gain value and first fader gain value are obtained substantially simultaneously at a first position of the common adjustment apparatus, and the second gain-trim gain value and second fader gain value are obtained substantially simultaneously at a second position of the common adjustment apparatus.

A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.

A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.

A sensor arrangement includes a substrate having a through opening between a first and a second main surface region, a sound transducing portion at the first main surface region of the substrate and spanning the through opening in the substrate, and a pressure sensing portion at the first main surface region of the substrate and fluidically coupled to the through opening in the substrate. The sound transducing portion includes a deflectable membrane structure, and a counter electrode. The pressure sensing portion includes a first and second rigid electrode and a deflectable membrane structure. The deflectable membrane structure of the pressure sensing portion opposes the plane of the first main surface region of the substrate. The first and second rigid electrodes of the pressure sensor form a reference capacitor of the pressure sensor, and the second rigid electrode and the membrane structure form a sense capacitor of the pressure sensor.

A sensor arrangement includes a substrate having a through opening between a first and a second main surface region, a sound transducing portion at the first main surface region of the substrate and spanning the through opening in the substrate, and a pressure sensing portion at the first main surface region of the substrate and fluidically coupled to the through opening in the substrate. The sound transducing portion includes a deflectable membrane structure, and a counter electrode. The pressure sensing portion includes a first and second rigid electrode and a deflectable membrane structure. The deflectable membrane structure of the pressure sensing portion opposes the plane of the first main surface region of the substrate. The first and second rigid electrodes of the pressure sensor form a reference capacitor of the pressure sensor, and the second rigid electrode and the membrane structure form a sense capacitor of the pressure sensor.

The microphone device includes a tubular support of a conductive material. A microphone unit is provided at one end of the support and grounded to the support. A cable passes through the support and includes core wires connected to a signal output terminal of the microphone unit. A conductive covering material that covers the core wires and is electrically connected to the support.

A unidirectional condenser microphone having a front opening portion and a rear opening portion for respectively passing sound waves to a front surface and a back surface of a diaphragm of a microphone unit, the unidirectional condenser microphone includes: an acoustic tube provided in the front opening portion; a first air chamber provided between the rear opening portion and the back surface of the diaphragm of the microphone unit, and having a predetermined acoustic capacity; and a second air chamber communicating into the first air chamber, and having an acoustic capacity larger than the predetermined acoustic capacity, wherein sensitivity to a direction of 0° with respect to a directional axis is improved by the first air chamber and the acoustic tube, and a proximity effect due to the sound wave from a direction of 180° with respect to the directional axis is prevented by the second air chamber.

A unidirectional condenser microphone having a front opening portion and a rear opening portion for respectively passing sound waves to a front surface and a back surface of a diaphragm of a microphone unit, the unidirectional condenser microphone includes: an acoustic tube provided in the front opening portion; a first air chamber provided between the rear opening portion and the back surface of the diaphragm of the microphone unit, and having a predetermined acoustic capacity; and a second air chamber communicating into the first air chamber, and having an acoustic capacity larger than the predetermined acoustic capacity, wherein sensitivity to a direction of 0° with respect to a directional axis is improved by the first air chamber and the acoustic tube, and a proximity effect due to the sound wave from a direction of 180° with respect to the directional axis is prevented by the second air chamber.

The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.