A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mechanically displace relative to the backplate as a function of sound pressure incident upon the diaphragm. The diaphragm may comprise third and fourth electrodes electrically isolated from one another and mechanically coupled to the diaphragm in a fixed relationship relative to the diaphragm such that the third and fourth electrodes mechanically displace relative to the backplate as the function of the sound pressure. The first and third electrodes may form a first capacitor, the second and fourth electrodes may form a second capacitor, and the first capacitor may be configured to sense a displacement of the diaphragm responsive to which the second capacitor may be configured to apply an electrostatic force to the diaphragm to return the diaphragm to an original position.

A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mechanically displace relative to the backplate as a function of sound pressure incident upon the diaphragm. The diaphragm may comprise third and fourth electrodes electrically isolated from one another and mechanically coupled to the diaphragm in a fixed relationship relative to the diaphragm such that the third and fourth electrodes mechanically displace relative to the backplate as the function of the sound pressure. The first and third electrodes may form a first capacitor, the second and fourth electrodes may form a second capacitor, and the first capacitor may be configured to sense a displacement of the diaphragm responsive to which the second capacitor may be configured to apply an electrostatic force to the diaphragm to return the diaphragm to an original position.

A microphone package includes a housing; a control circuit chip accommodated in the housing; a micro-electromechanical chip accommodated in the housing; and a circuit board forming an accommodation space with the housing. The circuit board includes a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip. The micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a number of isolation holes for receiving the conductive pads.

A microphone package includes a housing; a control circuit chip accommodated in the housing; a micro-electromechanical chip accommodated in the housing; and a circuit board forming an accommodation space with the housing. The circuit board includes a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip. The micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a number of isolation holes for receiving the conductive pads.

An electret element includes: an electret film that contains silicon oxide; and a protective film formed over the electret film and constituted of aluminum oxide deposited through an atomic layer deposition method.

An electret element includes: an electret film that contains silicon oxide; and a protective film formed over the electret film and constituted of aluminum oxide deposited through an atomic layer deposition method.

A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

The present invention disclosed a micro acoustic collector with a lateral cavity, comprising: a base metal layer; a movable film, an annular side wall; a lateral metal layer. The movable film faces towards the base metal layer to form a hollow space. The lateral metal layer is formed at a side of the movable film and around the movable film, fixed by the annular side wall and spaced apart from peripheral of the movable film by a distance, and the lateral metal layer faces towards the base metal layer to form a lateral cavity to assist an acoustic collection.