In various embodiments, a circuit arrangement is provided. The circuit arrangement includes a sensor set up to provide an analogue signal, an analogue/digital converter set up to receive the analogue signal and to provide a first signal, and a first filter set up to receive a signal based on the first signal and to provide a second signal. The first filter is set up in such a manner that the second signal is allowed through without amplification or substantially without amplification in a frequency range of approximately 20 Hz to approximately 10 kHz, and the second signal has a gain of greater than 0 dB at least above a predefined frequency which is greater than approximately 20 kHz.

The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.

A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

A laminated structure includes a frame body having a first surface and a second surface facing in mutually opposite directions in a thickness direction, the frame body including a film body supported by the frame body and a hollow portion opening at the second surface and being located between the film body and the second surface; and a lid body attached to the frame body, including cavity located on the film body and an opening which communicates with the cavity and being formed at a positon at which at least a part of the film body is exposed to an external space of the laminated structure. The lid body includes a groove portion formed in a surface (a back surface) of the lid body facing the frame body, and the cavity and the external space of the laminated structure communicate with each other through the groove portion.

A laminated structure includes a frame body having a first surface and a second surface facing in mutually opposite directions in a thickness direction, the frame body including a film body supported by the frame body and a hollow portion opening at the second surface and being located between the film body and the second surface; and a lid body attached to the frame body, including cavity located on the film body and an opening which communicates with the cavity and being formed at a positon at which at least a part of the film body is exposed to an external space of the laminated structure. The lid body includes a groove portion formed in a surface (a back surface) of the lid body facing the frame body, and the cavity and the external space of the laminated structure communicate with each other through the groove portion.

The invention provides a MEMS acoustic sensor, including: a base with a back cavity; a capacitance system fixed to the base, including a diaphragm that reciprocates in a vibration direction, a back plate spaced from the diaphragm; a first capacitor and a second capacitor formed cooperatively by the diaphragm and the back plate; and a number of through holes in the back plate facing the back cavity. The diaphragm includes a main body part opposite to the back plate for forming the first capacitor, and a plurality of combining parts recessed from the main body part. A projection of the combining part along the vibration direction completely falls into the through hole. The combining part is spaced from an inner wall of the through hole for forming the second capacitor. Due to the configuration of the invention, the acoustic sensor has improved capacitor value.

Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

Disclosed are a MEMS microphone structure and a manufacturing method thereof. More particularly, a MEMS microphone structure and a manufacturing method thereof are disclosed, including a plurality of diaphragms and a plurality of back plates configured alternately in a vertical direction so that the areas of the diaphragms and the back plates are maximized within a limited area, thereby improving overall sensitivity.

Disclosed are a MEMS microphone structure and a manufacturing method thereof. More particularly, a MEMS microphone structure and a manufacturing method thereof are disclosed, including a plurality of diaphragms and a plurality of back plates configured alternately in a vertical direction so that the areas of the diaphragms and the back plates are maximized within a limited area, thereby improving overall sensitivity.