The MEMS microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an ASIC chip located in the cavity; and an MEMS chip having a back cavity. The first circuit board is electrically connected with the second circuit board by the plated-through-hole. The frame includes a conductive layer and an insulating layer, and the conductive layer is located between an inner surface of the frame and the insulating layer.

A microphone and a method of manufacturing the microphone are provided. The method includes; preparing a substrate and forming a vibrating membrane having an oxide film and a plurality of slots onto the substrate. A sacrificial layer and a fixed membrane is formed over the vibrating membrane and air intake apertures are formed through the fixed membrane. A first pad is connected to the fixed membrane, a second pad is connected to the vibrating membrane, and a phase delay unit is bonded to the bonding pad. A penetration aperture may be formed by etching the rear side of the substrate and bonding the phase delay unit on the bonding pad. A sound passage, is formed by connecting passage patterns, and sound apertures with the sound passages by sequentially stacking phase delay layers on the bonding pad and simultaneously forming the passage patterns in the phase delay layers.

A microphone and a method of manufacturing the microphone are provided. The method includes; preparing a substrate and forming a vibrating membrane having an oxide film and a plurality of slots onto the substrate. A sacrificial layer and a fixed membrane is formed over the vibrating membrane and air intake apertures are formed through the fixed membrane. A first pad is connected to the fixed membrane, a second pad is connected to the vibrating membrane, and a phase delay unit is bonded to the bonding pad. A penetration aperture may be formed by etching the rear side of the substrate and bonding the phase delay unit on the bonding pad. A sound passage, is formed by connecting passage patterns, and sound apertures with the sound passages by sequentially stacking phase delay layers on the bonding pad and simultaneously forming the passage patterns in the phase delay layers.

An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.

An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.

An ear cup for a hearing protector includes a cup-shaped outer casing, a sealing ring on a rim of the outer casing, and at least one electrical component such as a microphone. The electrical component is mounted on a flexible circuit board attached on the outer surface of the outer casing, where the outer casing includes a slit through which the flexible circuit board extends to the inside of the outer casing so as to provide electrical connections between the electrical component and an electrical circuitry inside the outer casing. Thus, there is no need for wide openings on the outer casing of the ear cup, instead only a narrow slit suffices. This facilitates achieving good noise reduction properties.

An ear cup for a hearing protector includes a cup-shaped outer casing, a sealing ring on a rim of the outer casing, and at least one electrical component such as a microphone. The electrical component is mounted on a flexible circuit board attached on the outer surface of the outer casing, where the outer casing includes a slit through which the flexible circuit board extends to the inside of the outer casing so as to provide electrical connections between the electrical component and an electrical circuitry inside the outer casing. Thus, there is no need for wide openings on the outer casing of the ear cup, instead only a narrow slit suffices. This facilitates achieving good noise reduction properties.

Sound waves cause pressure changes in the air, and the pressure changes cause changes in the dielectric constant of air. Capacitive sensor measurements indicative of the changes in the dielectric constant of air can be processed to extract features associated with sound waves in the air. The features can include sound pressure levels represented and recordable as audio samples. Furthermore, the features can help identify types of sounds, determine direction of travel of the sound waves, and/or determine the source location of the audio. Instead of relying on movement of a mechanical member to transduce sound waves through a port into an electrical signal, an improved microphone uses capacitive sensing to directly sample and sense static pressure as well as dynamic pressure or pressure changes in the air to derive audio samples. The resulting microphone avoids disadvantages of the conventional microphone having the moving mechanical member and port.

Sound waves cause pressure changes in the air, and the pressure changes cause changes in the dielectric constant of air. Capacitive sensor measurements indicative of the changes in the dielectric constant of air can be processed to extract features associated with sound waves in the air. The features can include sound pressure levels represented and recordable as audio samples. Furthermore, the features can help identify types of sounds, determine direction of travel of the sound waves, and/or determine the source location of the audio. Instead of relying on movement of a mechanical member to transduce sound waves through a port into an electrical signal, an improved microphone uses capacitive sensing to directly sample and sense static pressure as well as dynamic pressure or pressure changes in the air to derive audio samples. The resulting microphone avoids disadvantages of the conventional microphone having the moving mechanical member and port.

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm being disposed between the substrate and the back plate and being spaced apart from the substrate and the back plate and at least one anti-buckling portion provided between the substrate and the diaphragm. The diaphragm covers the cavity and the diaphragm senses an acoustic pressure to create a displacement. The anti-buckling portion is configured to temporarily support the diaphragm in case of a warpage of the diaphragm to prevent a buckling of the diaphragm. Thus, the MEMS microphone can prevent the diaphragm from generating a warpage by more than a predetermined degree, so that the diaphragm can have a tensile stress and the buckling phenomenon of the diaphragm can be prevented.