A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.

An impedance matching method for an electret microphone is provided. In some embodiments, the impedance matching method includes collecting a bias voltage between a source and a drain of a field effect transistor built in the electret microphone; determining whether the bias voltage is within a preset bias voltage threshold range; and if it is detected that the bias voltage is not within the preset bias voltage threshold range, sending a corresponding control signal to adjust load bias impedance so that the bias voltage is within the preset voltage threshold. An impedance matching apparatus for an electret microphone and a communication device are also provided.

An impedance matching method for an electret microphone is provided. In some embodiments, the impedance matching method includes collecting a bias voltage between a source and a drain of a field effect transistor built in the electret microphone; determining whether the bias voltage is within a preset bias voltage threshold range; and if it is detected that the bias voltage is not within the preset bias voltage threshold range, sending a corresponding control signal to adjust load bias impedance so that the bias voltage is within the preset voltage threshold. An impedance matching apparatus for an electret microphone and a communication device are also provided.

A capacitance type transducer has a substrate with an opening on a surface thereof, a back plate arranged to oppose the opening of the substrate, and a vibrating electrode film arranged to oppose the back plate across a gap between the vibrating electrode film and the back plate. The capacitance type transducer converts a displacement of the vibrating electrode film into a change in capacitance between the vibrating electrode film and the back plate. The capacitance type transducer has a pressure releasing flow channel which is an air flow channel formed by a gap between a part of the vibrating electrode film and a protruding portion integrally provided on the back plate.

A capacitance type transducer has a substrate with an opening on a surface thereof, a back plate arranged to oppose the opening of the substrate, and a vibrating electrode film arranged to oppose the back plate across a gap between the vibrating electrode film and the back plate. The capacitance type transducer converts a displacement of the vibrating electrode film into a change in capacitance between the vibrating electrode film and the back plate. The capacitance type transducer has a pressure releasing flow channel which is an air flow channel formed by a gap between a part of the vibrating electrode film and a protruding portion integrally provided on the back plate.

A MEMS microphone assembly includes a MEMS transducer element having a back plate and a diaphragm displaceable relative to the back plate. A bias voltage generator is adapted to provide a DC bias voltage applicable between the diaphragm and the back plate. An amplifier receives an electrical signal from the MEMS transducer element and provides an output signal. The amplifier is adapted to amplify the electrical signal from the MEMS transducer element according to an amplifier gain setting. A processor is adapted to carry out a calibration routine at power-on of the microphone assembly determining information regarding the DC bias voltage and/or the amplifier gain setting.

Embodiments relate to an apparatus for determining a sensitivity of a capacitive sensing device having a sensor capacitor with a variable capacitance. The apparatus includes a measurement module and a processor. The measurement module is configured to determine, in response to a first electrical input signal to the sensor capacitor, a first quantity indicative of a first capacitance of the sensor capacitor and to determine, in response to a second electrical input signal to the sensor capacitor, a second quantity indicative of a second capacitance of the sensor capacitor. The processor is configured to determine a quantity indicative of the sensitivity of the sensing device based on the determined first and second quantity.

Embodiments relate to an apparatus for determining a sensitivity of a capacitive sensing device having a sensor capacitor with a variable capacitance. The apparatus includes a measurement module and a processor. The measurement module is configured to determine, in response to a first electrical input signal to the sensor capacitor, a first quantity indicative of a first capacitance of the sensor capacitor and to determine, in response to a second electrical input signal to the sensor capacitor, a second quantity indicative of a second capacitance of the sensor capacitor. The processor is configured to determine a quantity indicative of the sensitivity of the sensing device based on the determined first and second quantity.

A condenser microphone unit includes a diaphragm vibrated by acoustic waves, a fixed electrode disposed to face the diaphragm, and an insulation base making contact with a rim portion of the fixed electrode to support the fixed electrode, wherein a ring-shaped protrusion is provided on a rim portion of the insulation base, the ring-shaped protrusion protruding toward the fixed electrode with a radially inward taper and having a ring-shaped distal face to oppose the rim portion of the fixed electrode, the distal face of the ring-shaped protrusion supports the rim portion of the fixed electrode, and an adhesive is provided on a tapered surface of the ring-shaped protrusion positioned between the insulation base and the fixed electrode, the adhesive having property to shrink by curing. When the adhesive is cured, contact portions of the insulation base and the fixed electrode are tightly bonded together.

A condenser microphone unit includes a diaphragm vibrated by acoustic waves, a fixed electrode disposed to face the diaphragm, and an insulation base making contact with a rim portion of the fixed electrode to support the fixed electrode, wherein a ring-shaped protrusion is provided on a rim portion of the insulation base, the ring-shaped protrusion protruding toward the fixed electrode with a radially inward taper and having a ring-shaped distal face to oppose the rim portion of the fixed electrode, the distal face of the ring-shaped protrusion supports the rim portion of the fixed electrode, and an adhesive is provided on a tapered surface of the ring-shaped protrusion positioned between the insulation base and the fixed electrode, the adhesive having property to shrink by curing. When the adhesive is cured, contact portions of the insulation base and the fixed electrode are tightly bonded together.