A microphone includes a microphone base that has a first surface and a second surface. The microphone also includes a microelectromechanical system (MEMS) device coupled to the first surface of the microphone base. The microphone also includes a cover coupled to the first surface of the microphone base, such that the cover divides the first surface into a covered portion where the cover encloses the MEMS device, and a non-covered portion extending away from the cover. The microphone also includes one or more pads on the uncovered portion of the first surface of the base. The microphone also includes a port extending through the base from the first surface to the second surface.

A microphone includes a microphone base that has a first surface and a second surface. The microphone also includes a microelectromechanical system (MEMS) device coupled to the first surface of the microphone base. The microphone also includes a cover coupled to the first surface of the microphone base, such that the cover divides the first surface into a covered portion where the cover encloses the MEMS device, and a non-covered portion extending away from the cover. The microphone also includes one or more pads on the uncovered portion of the first surface of the base. The microphone also includes a port extending through the base from the first surface to the second surface.

A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

A mobile device may include an enclosure and a rear cover assembly affixed to a back portion of the enclosure. The rear cover assembly may include a protruding portion that extends above a surrounding portion of the rear cover assembly. The protruding portion may include a number of through holes that extend through the protruding portion of the rear cover assembly. In one through hole, a tubular microphone may be provided. The tubular microphone may include a microphone enclosure which may contain a MEMS microphone device, an integrated circuit, and an interposer positioned between the MEMS microphone device and the integrated circuit. A height of the tubular microphone may be substantially similar to a thickness of the protruding portion and the tubular microphone may be entirely or partially disposed within a through hole of the protruding portion.

A mobile device may include an enclosure and a rear cover assembly affixed to a back portion of the enclosure. The rear cover assembly may include a protruding portion that extends above a surrounding portion of the rear cover assembly. The protruding portion may include a number of through holes that extend through the protruding portion of the rear cover assembly. In one through hole, a tubular microphone may be provided. The tubular microphone may include a microphone enclosure which may contain a MEMS microphone device, an integrated circuit, and an interposer positioned between the MEMS microphone device and the integrated circuit. A height of the tubular microphone may be substantially similar to a thickness of the protruding portion and the tubular microphone may be entirely or partially disposed within a through hole of the protruding portion.

A display panel and manufacturing method thereof, and a display device and health monitoring method thereof. The display panel includes a base substrate and a sonic sensor disposed on the base substrate. The sonic sensor is configured to monitor a sonic wave.

This application relates to methods and apparatus for digital microphones. Disclosed is a digital microphone apparatus (300) for outputting a digital output signal (DATA) at a sample rate defined by a received clock signal (CLK). The apparatus includes a band splitter (302) configured to receive a microphone signal (S.sub.MD) indicative of an output of a microphone transducer and split said microphone signal into first signal path (S.sub.P1) for frequencies in a first band and a second signal path (S.sub.P2) for frequencies in a second band, the frequencies of the second band being higher than the frequencies in the first band. A modulation block (304) is configured to operate on the second signal path to apply a selective gain modulation to signals in the second signal path.