A microphone amplifier unit, to which a microphone of a first form including an LED or a microphone of a second form without including an LED is connected, includes a microphone detecting unit that detects a connection state of the microphone of the first form or the second form based on potential information supplied to a specific terminal pin of a connector. In the microphone amplifier unit, appropriate circuit setting corresponding to functions of the respective microphones is made based on information obtained by the microphone detecting unit. With the configuration, a microphone connecting device that can commonly use the microphone of the first form and the microphone of the second form with a small number of pins is provided.

Disclosed is MEMS microphone. The MEMS microphone includes a substrate and a capacitor system disposed on the substrate. The capacitor system has a back plate, a diaphragm, an insulating space formed by the back plate and the diaphragm and at least one insulating support disposed in the insulating space and connected with the back plate or the diaphragm. When the MEMS microphone is working, the insulating support engages with the diaphragm or the back plate thereby dividing the diaphragm into at least two vibrating units which improves the sensitivity and SNR of the MEMS microphone. Meanwhile, the MEMS microphone has the advantage of low cost and is easy to be fabricated.

Disclosed is MEMS microphone. The MEMS microphone includes a substrate and a capacitor system disposed on the substrate. The capacitor system has a back plate, a diaphragm, an insulating space formed by the back plate and the diaphragm and at least one insulating support disposed in the insulating space and connected with the back plate or the diaphragm. When the MEMS microphone is working, the insulating support engages with the diaphragm or the back plate thereby dividing the diaphragm into at least two vibrating units which improves the sensitivity and SNR of the MEMS microphone. Meanwhile, the MEMS microphone has the advantage of low cost and is easy to be fabricated.

A MEMS backplate. The MEMS backplate includes a first mesh pattern having a first height and a first arrangement of openings, and a second mesh pattern having a second height and a second arrangement of vent hole apertures. The second mesh pattern is contained within the opening formed by the first mesh pattern.

A MEMS backplate. The MEMS backplate includes a first mesh pattern having a first height and a first arrangement of openings, and a second mesh pattern having a second height and a second arrangement of vent hole apertures. The second mesh pattern is contained within the opening formed by the first mesh pattern.

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures, a membrane disposed opposite to the plate and including a plurality of corrugations facing the plurality of apertures, and a conductive plug extending from the plate through the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.

A package includes a base structure, which has an electrically isolating material and/or an electrically conductive contact structure, an electronic component, which is embedded in the base structure or is arranged on the base structure, a microelectromechanical system (MEMS) component, and a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.

A package includes a base structure, which has an electrically isolating material and/or an electrically conductive contact structure, an electronic component, which is embedded in the base structure or is arranged on the base structure, a microelectromechanical system (MEMS) component, and a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.

A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially inside the housing and configured to detect acoustic waves. The inner surface of the housing wall is made in at least half of its entire area of a thermally insulating material.