The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.

The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.

A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.

A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.

A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.

Microphone systems including a MEMS microphone and an electronic controller. The MEMS microphone includes a movable membrane and a backplate. The movable membrane includes a capacitive electrode and a piezoelectric electrode. The capacitive electrode is configured such that acoustic pressures acting on the movable membrane cause movement of the capacitive electrode. The piezoelectric electrode alters a mechanical property of the MEMS microphone based on a control signal. The backplate is positioned on a first side of the movable membrane. The electronic controller is electrically coupled to the piezoelectric electrode and is configured to generate the control signal.

Microphone systems including a MEMS microphone and an electronic controller. The MEMS microphone includes a movable membrane and a backplate. The movable membrane includes a capacitive electrode and a piezoelectric electrode. The capacitive electrode is configured such that acoustic pressures acting on the movable membrane cause movement of the capacitive electrode. The piezoelectric electrode alters a mechanical property of the MEMS microphone based on a control signal. The backplate is positioned on a first side of the movable membrane. The electronic controller is electrically coupled to the piezoelectric electrode and is configured to generate the control signal.

In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.

In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.