Patent classifications
H04R19/04
MEMS microphone, method of manufacturing the same and MEMS microphone package including the same
A MEMS microphone includes a substrate defining a cavity including a first sidewall extending a vertical direction, a back plate disposed over the substrate and defining a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, the diaphragm having at least one vent hole, an anchor extending from a circumference of the diaphragm to connect an end portion of the diaphragm to an upper surface of the substrate, and at least one path member communicating with the vent hole, the path member providing a flow path for the acoustic pressure to flow downwardly toward the cavity.
MEMS microphone and manufacturing method thereof
A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
MEMS microphone and manufacturing method thereof
A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
Composite diaphragms having balanced stress
An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.
Sound transducer and electronic device
A sound transducer includes a substrate including a first surface, a second surface, and a cavity, a support structure disposed on the first surface and including an inner peripheral edge and a third surface, a fixing structure disposed on the third surface, a moving structure including an exterior peripheral edge and a fourth surface, a first set of comb fingers fixed to the inner peripheral edge, extending toward the moving structure, and being electrically isolated from the fixing structure and the moving structure, a second set of comb fingers fixed to the exterior peripheral edge, extending toward the support structure, and interdigitated with the first set of comb fingers, and an elastic connecting structure including a first connecting part connected to the fourth surface, a second connecting part connected to the fixing structure, and an elastic body; the moving structure is disposed above the cavity.
ADAPTERS FOR MICROPHONES AND COMBINATIONS THEREOF
A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.
ADAPTERS FOR MICROPHONES AND COMBINATIONS THEREOF
A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.
UNIDIRECTIONAL MICROPHONE
A unidirectional microphone includes: a case having a shape of a bottomed cylinder and including a sound hole in a bottom thereof; a ring-shaped diaphragm fixed to the bottom in the case; a vibrating membrane stretched on the diaphragm; a backplate which has a shape of a bottomed cylinder and is housed in the case in a nested manner such that an air gap to serve as a sound propagation path is formed between the backplate and an inner surface of the case, the backplate including an aperture serving as a sound propagation path in a side face thereof; a spacer positioned between the diaphragm and the backplate to fix the diaphragm and the backplate, and including a notch serving as a sound propagation path in a portion thereof; and a base plate covering a top opening of the case and including a hole serving as a sound propagation path.
Sensor device and manufacturing method thereof
A micro electro mechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a first cavity disposed between the first membrane and the third membrane and surrounded by a first wall, a second cavity disposed between the second membrane and the third membrane and surrounded by a second wall, and one or more first supports disposed in the first cavity and connecting the first membrane and the third membrane.
Sensor device and manufacturing method thereof
A micro electro mechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a first cavity disposed between the first membrane and the third membrane and surrounded by a first wall, a second cavity disposed between the second membrane and the third membrane and surrounded by a second wall, and one or more first supports disposed in the first cavity and connecting the first membrane and the third membrane.