The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a diaphragm, a backplate, and a sidewall stopper. The diaphragm has a venting hole disposed therethrough. The backplate is disposed over and spaced apart from the diaphragm. The sidewall stopper is disposed along a sidewall of the diaphragm exposing to the venting hole. Thus, the sidewall stopper is not limited by a distance between the movable part and the stable part of the microphone. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.

A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.

A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.

A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.

A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a carrier: a diaphragm connected to and deflectable with respect thereto the carrier and a piezoelectric element spaced apart from the diaphragm along a reciprocation axis. The piezoelectric element includes a coupling element that extends along the reciprocation axis and connects to the diaphragm. The piezoelectric element and the coupling element form a cantilever. The MEMS sound transducer includes two cantilever arms are arranged one behind the other, in a top view.

A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a carrier: a diaphragm connected to and deflectable with respect thereto the carrier and a piezoelectric element spaced apart from the diaphragm along a reciprocation axis. The piezoelectric element includes a coupling element that extends along the reciprocation axis and connects to the diaphragm. The piezoelectric element and the coupling element form a cantilever. The MEMS sound transducer includes two cantilever arms are arranged one behind the other, in a top view.

An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.