An electronic device package comprises an electronic acoustic device including a primary microphone having a frequency response having a resonance frequency, and a reference microphone having a frequency response including a resonance frequency. The primary microphone and the reference microphone are configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the primary microphone. An equalization module is configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone. The package defines a first back cavity of the primary microphone and a second back cavity of the reference microphone, the second back cavity being acoustically isolated from the first back cavity.

An electronic device package comprises an electronic acoustic device including a primary microphone having a frequency response having a resonance frequency, and a reference microphone having a frequency response including a resonance frequency. The primary microphone and the reference microphone are configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the primary microphone. An equalization module is configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone. The package defines a first back cavity of the primary microphone and a second back cavity of the reference microphone, the second back cavity being acoustically isolated from the first back cavity.

A microphone assembly for a vehicle headliner includes a housing arranged to be received within a substrate layer of the headliner and having an upper portion and a lower portion. A circuit board is mounted in the upper portion and has a microphone element coupled thereto. An insert bracket includes a base and a shaft member extending upwardly therefrom, the base having a plurality of apertures aligned with the shaft member, wherein the shaft member engages the lower portion to connect the insert bracket to the housing. A sealing gasket having at least one channel defining an air path extending therethrough is arranged to be received within the shaft member and extend between the base and the upper portion, providing acoustic sealing between the insert bracket and the housing such that the air path directs sound from a cabin of the vehicle through the apertures to the microphone element.

The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.

The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.

The two-way communication system comprises a non-invasive and non-implanted system which remains completely invisible to an outside observer when in use by an operator or user and allows for clear two-way communications. This system is generally comprised of a mouthpiece component, relay component, infrastructure communication device, and an optional system control which may interface with the relay component.

The two-way communication system comprises a non-invasive and non-implanted system which remains completely invisible to an outside observer when in use by an operator or user and allows for clear two-way communications. This system is generally comprised of a mouthpiece component, relay component, infrastructure communication device, and an optional system control which may interface with the relay component.