In accordance with an embodiment, microelectromechanical microphone includes a holder and a sound detection unit carried on the holder. The sound detection unit includes a planar first membrane, a planar second membrane arranged at a distance from the first membrane, a low-pressure chamber formed between the first membrane and the second membrane, a reduced gas pressure relative to normal pressure being present in the low-pressure chamber, a reference electrode arranged at least in sections in the low-pressure chamber, where the first and second membranes are displaceable relative to the reference electrode by sound waves to be detected, the reference electrode includes a planar base section and a stiffening structure provided on the base section, and the stiffening structure is provided on a side of the base section that faces the first membrane or/and on a side of the base section that faces the second membrane.

A microphone and its manufacturing method, relating to semiconductor techniques. The microphone comprises a capacitor comprising of a back plate and a vibration film plate, with the vibration film plate comprising a plurality of holes. The holes in the vibration film plate provide a ventilation route for pressured air in the microphone, and thus reduce the pressure on the vibration film plate which otherwise is susceptible to damaged under high air pressure. This inventive concept improves a microphone's acoustic tolerance.

This invention consists of a new analyzer system of the sounds generated in mills that capture the signals issued by the mineral and steel balls cascade that perform grinding. These signals are processed in an embedded system (2) formed by a field programmable gates array (FPGA) and a processor. The system is comprised of an industrial microphone array (1) that captures the sound signals that are converted from analog to digital through and acquisition system (3) specialized in sound signals, processed by a FPGA capable of performing parallel operations at high speed due to the customized hardware developed for this application, and sent to the processor through a high-speed data bus.

According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.

According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.

A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.

Diaphragm element arrangements including at least one bistable diaphragm element, which has a first stable state and a second stable state, and corresponding methods are provided. The bistable diaphragm element can be activated above a changeover threshold in order to change over between the first and the second stable state or below the changeover threshold.

An audio sensing device having a resonator array and a method of acquiring frequency information using the audio sensing device are provided. The audio sensing device includes a substrate having a cavity formed therein, a membrane provided on the substrate and covering the cavity, and a plurality of resonators provided on the membrane and respectively sensing sound frequencies of different frequency bands.