An acoustic wave device includes a cover portion, an outer support layer, a support portion, a piezoelectric substrate, and functional elements on the piezoelectric substrate. The outer support layer is on the piezoelectric substrate around a region where the functional elements are disposed. The cover portion is opposed to the piezoelectric substrate with the outer support layer interposed therebetween. The support portion is in a hollow space defined by the piezoelectric substrate, the outer support layer, and the cover portion. The height of the support portion is smaller than that of the outer support layer and larger than that of each of the functional elements. A gap is provided between the support portion and the cover portion or between the support portion and the piezoelectric substrate.

This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

Disclosed is a sound-producing device including a voice coil, comprising a bobbin and a voice coil body wound outside the bobbin; and a damper having a first connecting part and a second connecting part; wherein the first connecting part is fixedly connected to the voice coil, and the second connecting part is fixed on the sound-producing device; there is provided a planar elastic member between the first connecting part and the second connecting part, the planar elastic member is bent and extends from the first connecting part to the second connecting part; the damper is made of conductive material, and is configured to establish electrical communication with the voice coil; the sound-producing device has a height in a vibration direction thereof ranging from 5 mm to 200 mm.

One of the main objects of the present invention is to provide a bone conduction microphone with simplified structure and easier manufacturing process. To achieve the above-mentioned objects, the present invention provides a bone conduction microphone, including: a housing; a circuit board opposite to the housing; and a vibration assembly locating between the housing and the circuit board. The vibration assembly includes a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board. The bone conduction microphone further includes a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal.

An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.

A tool for arranging voice coil leadouts in a microspeaker comprises an expanding collet constructed and arranged for positioning at an interior of a bobbin having an inner diameter, the expanding collet including a hole that extends through an interior in a longitudinal direction of the expanding collet; a center pin extending through the hole of the expanding collet, the expanding collet applying a force against the inner diameter of the bobbin in response to a position of the center pin in the hole of the expanding collet relative to the interior of the expanding collet; and a forming mandrel including a hole that extends through an interior in a longitudinal direction of the forming mandrel. The expanding collet extends through the hole in, and coaxial with, the forming mandrel. The expanding collet rotates the bobbin about the longitudinal direction of the expanding collet relative to the forming mandrel to form helical leadout regions of a voice coil about the bobbin.

The application discloses a bone conduction acoustic device, a method for assembling bone conduction acoustic device and a bone conduction earphone. The bone conduction acoustic device includes: a case, which includes a base case portion and a side case portion connected with the base case portion, a cavity with an opening at one end is formed between the base case portion and the side case portion; a cover connected to the side case portion and sealing the opening; the magnet assembly connected to the cover and located in the cavity; a voice coil assembly arranged in the cavity, and voice coil assembly part is arranged opposite to the magnet assembly part for driving the magnetic assembly to vibrate; and a circuit board arranged in the cavity and electrically connected to the voice coil assembly, the circuit board is located between the base case portion and the voice coil assembly. When the bone conduction acoustic device of the present application is installed, it is only necessary to install the circuit board and the voice coil assembly in the housing first, and then install the cover connected with the magnet assembly to the housing to complete the installation. The overall structure is simpler and more compact, and the assembly is more convenient.

A microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of supporting portions, a plurality of damping portions, and a bearing portion. The plurality of supporting portions are spaced apart from each other. Each of the plurality of damping portions is disposed on an inner surface of the corresponding supporting portion. The bearing portion is connected to the plurality of damping portions and is suspended between the plurality of supporting portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending sections.

The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes an output driver circuit, a low drop out (LDO) regulator circuit, and an over-voltage protection circuit with improved capacity and response time.