Patent classifications
H04R31/006
MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.
MINIATURE LOUDSPEAKER
Disclosed is a miniature loudspeaker, comprising a magnetic circuit system which comprises a yoke, a magnet and a washer, the yoke and the magnet are fixedly bonded, the magnet and the washer are fixedly bonded, a snap-fitting portion and a limiting portion, which are mutually cooperated, are disposed on the yoke and the magnet and/or on the magnet and the washer, the limiting portion is a structure formed by removing material, the snap-fitting portion and the limiting portion are both located on bonding surfaces of two components, and the limiting portion and the snap-fitting portion are coupled and fixed. In the miniature loudspeaker, arranging a locating structure can increase a contact area between the yoke and the magnet and/or between the magnet and the washer, which enhances the bonding force, and makes the fixture firmer and more stable, thereby ensuring the performance of the miniature loudspeaker.
Sounding device
A sounding device includes a positioning bracket, a vibration system fixed to the positioning bracket, and a magnetic circuit system driving the vibration system to vibrate to generate sound. The vibration system includes a diaphragm fixed to the positioning bracket and a voice coil driving the diaphragm to vibrate. The magnetic circuit system includes a yoke, a main magnet component, and auxiliary magnet components. The yoke includes a yoke body, yoke extension walls, and yoke sidewalls. The auxiliary magnet component is fixed on the yoke extension wall. The main magnet component is sequentially spaced apart from the auxiliary magnet component and the yoke sidewall to form the magnetic gap. The positioning bracket is made of a metal material. One side of the auxiliary magnet component away from the yoke is fixed to the positioning bracket by laser spot welding. The sounding device has a better reliability.
Damping Spring
Embodiments disclosed in the present disclosure relate to vibration transducers. Such a transducer includes an electromagnet having a conductive coil. The conductive coil is configured to be driven by an electrical input signal to generate magnetic fields. The transducer further includes a magnetic diaphragm that is configured to mechanically vibrate in response to the generated magnetic fields. Additionally, the transducer includes a pair of cantilevered arms formed from damping steel. The cantilevered arms couple the magnetic diaphragm to a frame. The magnetic diaphragm vibrates with respect to the frame when the electromagnet is driven by the electrical input signal. Additionally, the pair of flexible support arms are connected to opposing sides of the magnetic diaphragm.
Structure for integrated microphone
The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.
Speaker
The present disclosure provides a speaker, including a vibrating system and a magnetic circuit system driving the vibrating system to vibrate and sound, the magnetic circuit system includes a main magnet assembly, the main magnet assembly includes a first main magnet, a magnetic conductive piece and a second magnet which are arranged by stacking, poles of the first main magnet and the second main magnet having a same polarity are opposite to each other, the magnetic conductive piece includes a body portion clamped between the first main magnet and the second main magnet, and a clamping portion bending and extending from the body portion, the clamping portion includes a first clamping portion for fixing the first main magnet and a second clamping portion for fixing the second main magnet. The speaker provided by the present disclosure improves acoustic performance through providing the clamping portion on the magnetic conductive piece.
MEMS SOUND TRANSDUCER WITH A DAMPING LAYER MADE OF ADHESIVE
A transducer unit for a MEMS sound transducer includes a support, a transducer element connected to the support and deflectable along a reciprocation axis, a coupling element for connecting the transducer element to a diaphragm in a manner spaced apart from the transducer element, and a spring region formed between the transducer element and the coupling element, the spring region including at least one spring element, which movably connects the transducer element to the coupling element, and which includes a damping layer, which at least partially covers the spring element.
Speaker device
A speaker device includes: a housing provided with an accommodating space, and a sounding member accommodated in the accommodating space. The sounding member includes a magnetic circuit unit and a vibration unit provided with a diaphragm. The housing includes an upper housing and a lower housing. The lower housing includes: a metal bottom wall, lower metal side walls, and, and sealing connectors respectively provided between two adjacent lower metal side walls of the plurality of lower metal side walls. An end of the lower metal side wall close to the upper housing bends and extends in a direction perpendicular to a vibrating direction of the diaphragm to form a bending edge. The bending edge and a bottom surface of the sealing connectors jointly form a sealing surface. The sealing surface is connected to the upper housing to seal. The speaker device can increase the powder filling space.
Speaker
Provided is a speaker, including: a frame, a first diaphragm and a flexible printed circuit board connected to the frame. The first diaphragm includes a first surface close to the flexible printed circuit board and arranged opposite to the flexible printed circuit board. The first surface is recessed along a direction departing from the flexible printed circuit board to form a glue slot. The first surface is connected to the flexible printed circuit board by glue to enable the glue to enter the glue slot. A thickness of the glue at a glue junction is increased to enhance strength of connection between the flexible printed circuit board and the first diaphragm to ensure reliability of mounting of the flexible printed circuit board on the first diaphragm, which may reduce a failure rate of the speaker.
Microelectromechanical systems vibration sensor
A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.