Presented herein are contaminant-proof microphone assemblies for use with devices/apparatuses, such as auditory prostheses, that include one or more microphones disposed within a housing. A contaminant-proof microphone assembly in accordance with certain embodiments presented herein includes a microphone, a microphone plug, and a contaminant-proof membrane. The microphone plug has a first end coupled to the microphone and a second end that is configured to be positioned adjacent the contaminant-proof membrane. As such, the microphone plug is disposed between a sound inlet of the microphone and the contaminant-proof membrane. The microphone plug may be configured to mate with the housing or a gasket attached to the housing.

A MEMS microphone includes a substrate, a diaphragm disposed over the substrate to cover the cavity, the diaphragm defining an air gap together with the back plate, and the diaphragm being spaced apart from the substrate, a back plate disposed over the diaphragm and in the vibration area, an upper insulation layer to cover the back plate, a plurality of chamber portions provided in the supporting area, a lower insulation layer provided under the upper insulation layer and on the substrate, and an intermediate insulation layer provided between the lower insulation layer and the upper insulation layer and disposed further from the vibration area than the chamber portions.

Disclosed in embodiments of the present disclosure are a capacitive MEMS microphone, a microphone unit and an electronic device. The capacitive MEMS microphone includes: a back electrode plate; a diaphragm; and a spacer for separating the back electrode plate from the diaphragm, wherein in a state where an operating bias is applied, a ratio of a static effective displacement of the diaphragm relative to a flat position to a thickness of the diaphragm is greater than or equal to 0.5.

A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

A method of operating a PMUT electro-acoustical transducer, the method comprising: applying over an excitation interval to the transducer an excitation signal which is configured to emit corresponding ultrasound pulses towards a surrounding space, acquiring at a receiver reflected ultrasound pulses as reflected in said surrounding space, generating a reference echo signal, performing a cross-correlation of said acquired received ultrasound pulses with said reference echo signal, performing a measurement based on the cross-correlation results, in particular a measurement of the time of flight of the ultrasound pulses, wherein said reference echo is obtained by finding an oscillation frequency of the transmitter on the basis of a transmitter ringdown signal, finding an oscillation frequency of the receiver on the basis of a receiver ringdown signal, performing a frequency tuning respectively on the transmitter and the receiver on the basis of said respective oscillation frequencies, then sweeping an input frequency of the transmitter to find a frequency of the maximum displacement in the ringdown signal, performing a frequency tuning of the receiver at said frequency of the maximum displacement in the ringdown signal of the transmitter.

The present disclosure discloses a MEMS microphone including a printed circuit board, a shell assembled with the printed circuit board for forming a receiving space and provided with a sound hole communicating with the receiving space, a MEMS Die with a cavity accommodated in the receiving space and mounted on the shell for covering the sound hole, and an ASIC chip accommodated in the receiving space and mounted on the shell through a substrate. The cavity of the MEMS Die communicates with the sound hole. The MEMS Die electrically connects with the ASIC chip. The ASIC chip electrically connects with the substrate. The substrate electrically connects with the printed circuit board.

A microphone assembly including an acoustic transducer configured to generate an electrical signal responsive to acoustic activity, an integrated circuit electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity, a cover, and a substrate. The substrate including a first surface and a second surface to which the cover is coupled. The second surface is disposed at a perimeter of the substrate and the first surface is raised with respect to the second surface. The cover is coupled to the substrate to form a housing in which the transducer and the integrated circuit are disposed.

A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.

The invention relates to a variable-directivity MEMS microphone. The microphone comprises an acoustic cavity. The following components are provided inside the acoustic cavity: a first acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a first acoustic conversion signal; a first pre-amplifier, connected to the first acoustic transducer, and configured for outputting a first electric signal; a second acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a second acoustic conversion signal; a second pre-amplifier, connected to the second acoustic transducer, and configured for outputting a second electric signal; and a signal processing chip, connected to the first pre-amplifier and the second pre-amplifier, and configured for generating a directional output signal by performing an arithmetic operation on the first electric signal and the second electric signal under the action of a switching control signal.

A testing system includes a testing apparatus and a crack noise monitoring device. The testing apparatus includes a testing stage and an element pickup module for pressing a semiconductor element on the testing stage. The crack noise monitoring device includes a database unit, a sound conduction set, a voiceprint generation unit and a processing unit. The database unit has a first voiceprint pattern. The sound conduction set is connected to the voiceprint generation unit and the testing apparatus for transmitting a sound wave from the semiconductor element to the voiceprint generation unit. The voiceprint generation unit receives and converts the sound wave into a second voiceprint pattern. The processing unit is electrically connected to the voiceprint generating unit and the database unit for determining whether the first voiceprint pattern is identical to the second voiceprint pattern.