A diaphragm for a loudspeaker drive unit or for a microphone includes a rigid dome-shaped member having a thickness that varies from a first thicker thickness at a first location at the periphery of the dome-shaped member to a second thinner thickness at a second location, which is nearer to the center of the dome-shaped member. There is a step-wise change in thickness at a location between the first location and the second location. Having greater thickness at the periphery of the dome-shaped member may improve stiffness of the diaphragm and may allow for an increased break-up frequency. Having thinner material elsewhere in the dome-shaped member may allow the mass of the diaphragm to be kept low and may result in better acoustic sensitivity.

A loudspeaker device includes first and second diaphragms arranged co-axially in an opposed relation to each other and having a rear volume in-between, each diaphragm having a plurality of motors operatively coupled thereto, and a frame having first and second ends, and first and second rims provided at the first and second ends, respectively. The motors of the first and second diaphragms are arranged in the same plane, and the motors are provided on the frame around the periphery of the first and second diaphragms.

According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.

An electroacoustic transducer is provided and includes: a diaphragm having a pair of longitudinal split tubular surfaces arranged next to each other, a valley being formed between respective side portions of the pair of longitudinal split tubular surfaces; a converter including a magnet mechanism and a voice coil configured to perform conversion between vibration of the diaphragm along a depth direction of the valley and an electric signal corresponding to the vibration; and a supporter that supports the diaphragm such that the diaphragm is vibratable along the depth direction of the valley. A tubular portion is provided at an intermediate portion of the valley to couple the diaphragm and the voice coil to each other, and the tubular portion extends in the depth direction of the valley.

Provided is a speaker diaphragm being able to reduce disturbance of sound pressure frequency properties of a high-tone range including an extremely high-tone range while reducing a manufacturing cost, a speaker including the speaker diaphragm, and the method for manufacturing the speaker diaphragm.

A diaphragm 30 includes a dome portion 32 vibratably supported by a speaker body 11 through an edge 14 and protruding in a Z-axis direction, and an annular cone portion 34 extending from an outer peripheral edge of the dome portion 32 in the direction inclined with respect to the Z-axis direction. The dome portion 32 and the cone portion 34 are, in a seamless manner, integrally made of magnesium or magnesium alloy, and an outer peripheral end of the cone portion 34 extends to the substantially same height position as the height P of the maximum protrusion position of the dome portion 32. An annular step portion 36 for attachment of a cylindrical voice coil bobbin 17 is provided along a boundary portion between the dome portion 32 and the cone portion 34.

According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.

An electrodynamic loudspeaker (10) including: a chassis (15), at least one magnetic circuit (20) secured to the chassis, at least one movable assembly (30) with respect to the chassis, the assembly (30) including a convex diaphragm (53) turned towards the outside of the loudspeaker, and at least one energizing coil (57) defining an axis (D) of the loudspeaker, a first suspension joint (35) connecting the assembly and the chassis, and a second suspension joint (40) of the assembly, the second joint being axially further away from the diaphragm than the first joint.

The assembly further comprises at least one connecting member (59) secured to the diaphragm, the second joint including a radially inner attachment point (81) attached on the connecting member, and a radially outer attachment point (83) attached on the chassis.

A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.

A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.

A diaphragm for a loudspeaker drive unit or for a microphone includes a rigid dome-shaped member having a thickness that varies from a first thicker thickness at a first location at the periphery of the dome-shaped member to a second thinner thickness at a second location, which is nearer to the centre of the dome-shaped member. There is a step-wise change in thickness at a location between the first location and the second location. Having greater thickness at the periphery of the dome-shaped member may improve stiffness of the diaphragm and may allow for an increased break-up frequency. Having thinner material elsewhere in the dome-shaped member may allow the mass of the diaphragm to be kept low and may result in better acoustic sensitivity.