A system and/or method is provided for enhanced listening of audio signals acquired via a telecoil by performing hum filtering. The system may include a telecoil and a telecoil hum filter. The telecoil hum filter may include a comb notch filter. The comb notch filter may include a delay module and a comb notch filter summing module. The telecoil may be operable to receive a magnetic signal and convert the magnetic signal to an input audio signal. The delay module of the comb notch filter may be configured to generate a delayed signal by applying a delay to the input audio signal. The delay may be based on a fundamental hum frequency. The comb notch filter summing module may be configured to generate a comb notch filter output signal by adding the input audio signal and the delay signal.

A hearing device configured to be worn at an ear of a user, where the hearing device comprising an antenna unit. The antenna unit comprises an active unit being connected to a ground unit by a feeder unit, the active unit includes an active surface, and a shield unit having a continuous surface, where a first section of the continuous surface may be arranged adjacent to the active surface. Furthermore, the active surface may be configured to transmit an electric field in a direction along or perpendicular to an ear-to-ear axis of the user when the hearing device may be worn in its operational position by the user, whereby the electric field may be coupled by a capacitive coupling towards the first section generating an electromagnetic near field, and where the shield unit may be configured to focus the electromagnetic near field inside the hearing device.

An apparatus including a transducer configured to generate sound, where the transducer comprises a diaphragm. At least one portion of the transducer is electrically conductive and is configured to provide an electrical connectivity to a ground. The at least one portion, at least in part, circumferences the diaphragm.

Embodiments presented herein are generally directed to a protective sleeve for an external component of a hearing prosthesis.

An electronic device is disclosed that may include a housing including a first surface facing in a first direction, a second surface facing in a second direction, and a third surface, the first and second direction being generally opposed to one another, the third surface being positioned between the first and second surfaces and being generally orthogonal relative to the first and second directions; at least one speaker arranged in at least a part of the housing; and a speaker enclosure protecting the speaker. The speaker enclosure may include an upper speaker enclosure arranged to face the first surface; and a lower speaker enclosure arranged to face the second surface, and confronting the upper speaker enclosure. Each of the upper and lower speaker enclosures may be at least partially made with magnetic materials that shield a magnetic flux generated in the speaker.

Presented herein are techniques for time interleaving the sampling of input signals with the delivery of stimulation signals to a recipient of an implantable electrically-stimulating hearing prosthesis. The input signals, which are received via one or more input channels and sampled by a sound processing unit, are susceptible to electrical feedback from the stimulation signals. As such, in accordance with embodiments presented herein, the sampling of the input signals by the sound processing unit, and the delivery of the stimulation signals to the recipient, are synchronized with one another so as to avoid stimulation-evoked electrical feedback within the input signals.

The present disclosure provides methods and systems for reducing noise induced in one or more components in a hearing aid. The present disclosure provides methods for reducing noise induced in telecoils.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.