The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

A diaphragm applied to a sound producing device, a sound producing device, and a method for assembling the same. The diaphragm comprises a film layer prepared by means of a crosslinking reaction of at least one of an ethylene-acrylate copolymer and an ethylene-acrylate-carboxylic acid copolymer. The molecular structure of the diaphragm comprises a vinyl-acrylic group. The group causes the material to have a less symmetrical chemical structure, a reduced tacticity and an increased steric hindrance, such that the diaphragm has a high loss factor, and the sound producing device achieves a good damping effect.

A speaker diaphragm and a molding method therefor are provided. The speaker diaphragm comprises: a lead wire; a lead wire enclosure portion, wherein the lead wire enclosure portion has a membrane part and support protrusions, the support protrusions are distributed on a surface of the membrane part, the thickness of the membrane part is larger than or equal to the diameter of the lead wire, the thickness of the overall lead wire enclosure portion is larger than the diameter of the lead wire, and a part of the lead wire is injection-molded in the lead wire enclosure portion; and a diaphragm layer, wherein the diaphragm layer is configured to form an overall structure of the speaker diaphragm, the thickness of the diaphragm layer is larger than or equal to the thickness of the overall lead wire enclosure portion, and the lead wire enclosure portion is injection-molded in the diaphragm layer.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

A loudspeaker diaphragm that includes a resin containing silica derived from seed coats and a compatibilizer as an additive.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

A method of forming a device having a compliant member includes providing an elastomeric layer in an uncured state. The elastomeric layer is pre-cured to increase its viscosity. Subsequently, a bobbin and housing, each having an end, can be positioned such that their ends extend at least partially into the elastomeric layer. The elastomeric layer is cured to secure it to the bobbin housing. Examples of pre-cure and cure operations include one or more of a thermal cure, evaporative cure and ultraviolet cure, and the application of moisture, microwave energy and chemical additive. Due to the increased viscosity after the pre-cure, the migration of elastomeric material is substantially reduced relative to an uncured elastomeric material. The reduction in elastomeric material migration results in smaller menisci formed along the walls of the housing and bobbin, and reduced thinning of the compliant member formed at their ends.

Articles and methods are provided for miniature acoustic transducers having highly compliant suspension systems despite their small size. In various examples the suspension system is molded of a liquid silicone rubber (LSR) and is molded in an interior cavity geometry that includes at least one of a radial offset or an axial offset from a desired geometry of the suspension.

A method of forming a device having a compliant member includes applying heat to a thermoplastic elastomer to maintain the thermoplastic elastomer in a softened state. The thermoplastic elastomer is extruded in the softened state as a film of thermoplastic elastomer. One or more of a bobbin and a housing, each having and end, is positioned such that the end extends at least partially into the film of thermoplastic elastomer. The positioning occurs when the thermoplastic elastomer is in the softened state and/or the bobbin and/or housing is at a temperature that is greater than a temperature of the film of thermoplastic elastomer. The film is cooled so that the bobbin and/or housing are secured to the film and so that the thermoplastic elastomer is in a state that exhibits rubber-like properties.

A speaker module and a manufacturing method thereof is provided in present invention. The speaker module includes a frame, a magnetic circuit system and a vibration system. The vibration system has a vibrating diaphragm and a voice coil. The magnetic circuit system includes a magnet and an upper magnetic plate arranged on the magnet. The speaker module further includes flexible circuit boards electrically connected with the voice coil. The upper magnetic plate and the flexible circuit boards are integrally injection molded in the frame. By virtue of the configuration described in the present invention, the connection between the frame and the magnetic circuit system is precise and stable.