A speaker includes a frame having an accommodation space; a magnetic circuit system accommodated in the accommodation space; and a vibration system accommodated in the accommodation space for generating sound. The vibration system includes a diaphragm and a voice coil. The diaphragm includes a first part fixed with the frame and a second part arranged between the first part and the frame. One end of the second part is connected with the first part. The accommodation space is divided by the second part into a first accommodation space for accommodating the magnetic circuit system and a second accommodation space for accommodating the voice coil.

The present invention relates to a speaker box module, and particularly relates to a loudspeaker that produces sound through the mechanical vibration generated by electromagnetic force and a manufacturing method therefor. The loudspeaker comprises a speaker box module which comprises a speaker, a passive radiator and a speaker box panel, wherein a mounting hole is arranged in the speaker box panel; the speaker is arranged in the mounting hole and is integrated with the speaker box panel by means of insert injection molding; a secondary mounting hole is arranged in the speaker box panel at one side of the mounting hole; and the passive radiator is arranged in the secondary mounting hole and is integrated with the speaker box panel by means of insert injection molding. The loudspeaker is small and thin, structurally simple, and enhances bass, and can be used as a built-in speaker or an external speaker for modern tablet computers or smart phones, and the like. In order to ensure that the speaker box has excellent acoustic effect, the present invention uses an insert injection integrated manufacturing process, which ensures maximum acoustic effect of the speaker box while greatly reducing man-hours and thereby increasing production efficiency.

A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

A diaphragm assembly and a loudspeaker having the diaphragm assembly. The diaphragm assembly comprises a silica gel diaphragm, the diaphragm comprises an annular bending portion, and a diaphragm center portion and a diaphragm edge portion arranged on inner and outer sides of the bending portion respectively; an annular support member (40) is joined to the diaphragm edge portion through injection modeling; a dome (30) is joined to the diaphragm center portion; the support member (40) is a metallic member; and the diaphragm edge is at least joined to two surfaces of the support member (40) through injection modeling.

A silica gel diaphragm, a receiver module, and a method for processing a silica gel diaphragm. Two metal pieces are integrally injection-molded on the diaphragm, and symmetrically embedded into the diaphragm, and either end of each of the metal pieces is provided with first and second soldering portions; each of the first soldering portions is embedded into a planar portion of the diaphragm, and is used for soldering a winding tap of a voice coil on an inner side of the voice coil; each of the second soldering portions protrudes from or is embedded into the fixing portion of the diaphragm, and is used for soldering a bonding pad on a housing; and middle portions connecting the first soldering portions and the second soldering portions are embedded into the diaphragm to form an electrically conductive path. This technical solution increases the product stability.

A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

An electroacoustic transducer includes: a diaphragm having two pairs of longitudinal split tubular surfaces; a converter that performs conversion between vibration of the diaphragm and an electric signal; and a supporter supporting the diaphragm. The two pairs of longitudinal split tubular surfaces form valleys and ridge portions. In each pair of the two pairs of longitudinal split tubular surfaces, one-side portions of the respective longitudinal split tubular surfaces form a valley. Another-side portion of the split tubular surface of each one of the two pairs and an other-side portion of the split tubular surface of the other of the two pairs form a ridge portion. The two pairs of longitudinal split tubular surfaces are arranged in at least one of a state in which the valleys are orthogonal to each other and a state in which the ridge portions are orthogonal to each other.

A bracket assembly suitable for use with an electronic device is described. The bracket assembly may include a bracket body having a channel. The bracket assembly may further include a membrane embedded in the bracket body and designed to allow air, but not liquid (such as water), to pass through the membrane. The membrane may be at least partially surrounded by a membrane support molded to the membrane. The membrane and the membrane support may be disposed in a molding tool to receive a material used to mold the bracket body over the membrane and the membrane support. During the molding operation, the membrane support may act as a buffer to shield the membrane from temperature and pressure increases associated with the molding operation of the bracket body. The bracket assembly may improve the ability of the electronic device to prevent liquid ingress.

Provided are a sound amplifying block formed of a permeable material and an air adsorbing material and having a layered structure and a method of manufacturing the same.

The sound amplifying block formed of a permeable material and an air adsorbing material and having a layered structure includes a porous grain formed by a first porous material that is an air adsorbing material that serves to amplify sound, a second porous material that is a permeable material and has a pore size and porosity greater than those of the first porous material, and a binder and a structural gap formed in a process of freezing the porous grain and formed between porous grains.

A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.