A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.

Hearing aid devices, methods of manufacture, methods of use, and kits are provided. In certain aspects, the hearing aid devices comprise an apparatus having a transducer and a retention structure comprising a shape profile corresponding to a tissue of the user, and a layer of elastomer.

A piezoelectric transducer comprises a deflectable structure having a first portion and a laterally adjoining second portion. The first portion has a piezoelectric layer and the second portion has an insulating material layer, and the second portion has a higher rigidity and a smaller mass per unit area than the first portion.

An attenuator is disclosed that enables a microphone's relatively undistorted pick up of a voice that is generated in close proximity to the microphone. This attenuator is a key component of a groundbreaking assistive device or handset/headset that empowers individuals with speech impairments to effectively communicate and reintegrate into society. By leveraging advanced acoustic hardware, intelligent voice algorithms, and a comprehensive image-or-vocabulary-to-impaired-voice database, the handset/headset facilitates understanding the user's impaired speech by harvesting understood terminology and outputting the same in a communicative context. Thus, the handset/headset enables seamless public interaction, independence, and improved quality of life to the user with speech impediments and ensures equal participation and inclusion in everyday verbal interactions.

Various implementations include miniature loudspeaker drivers. In some aspects, an electro-acoustic driver includes: a cone having a surface area configured to radiate acoustic energy; a suspension coupled to the cone; and a support structure coupled to the suspension and having an outer linear dimension in a plane of the cone of approximately 6.0 millimeters (mm) or less, wherein the surface area of the cone is at least 49% of an overall cross-sectional area of the electro-acoustic driver in the plane of the cone.

An electronic speaker comprising: a device housing defining an interior cavity and including a sidewall extending around the interior cavity between an upper portion and a lower portion of the device housing; first and second sound channels formed at opposing locations along the sidewall, each of the first and second sound channels comprising a plurality of openings formed through the sidewall; a passive radiator array comprising first and second passive radiators disposed within the interior cavity, spaced apart from each other in an opposing relationship and aligned to project sound through the first and second sound channels; an active driver disposed in the device housing and configured to generate sound in response to an electrical signal, the active driver comprising driver housing disposed at least partially between the first and second passive radiators, a magnet disposed within the driver housing, a voice coil and a diaphragm facing downwards towards the lower surface of the device housing; and an annular sound channel disposed along the bottom portion of the device housing adjacent to the diaphragm of the active driver.

A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.

The present disclosure relates to a design method for a piezoresistive-sensing-type microphone with an arc-shaped spring structure for ultra-miniaturization and high sensitivity. With the addition of the spring structure to the membrane, it is possible to minimize the membrane that has greater area for high sensitivity, and further, it is possible to minimize the area while providing the same effect as beam-shape springs and serpentine springs through an arc-shape spring design. A piezoresistor such as silicon nanowires with good piezoresistive properties as a sensing element is included in the spring structure to achieve high sensitivity, and the piezoresistor is placed in the spring structure at each location where the maximum tension occurs and where the maximum compression occurs through simulation. This allows both single-mode and differential-mode measurement, thereby ensuring the maximum resistance change and SNR.

An electronic speaker comprising: a device housing defining an interior cavity and including a sidewall extending around the interior cavity between an upper portion and a lower portion of the device housing; first and second sound channels formed at opposing locations along the sidewall, each of the first and second sound channels comprising a plurality of openings formed through the sidewall; a passive radiator array comprising first and second passive radiators disposed within the interior cavity, spaced apart from each other in an opposing relationship and aligned to project sound through the first and second sound channels; an active driver disposed in the device housing and configured to generate sound in response to an electrical signal, the active driver comprising driver housing disposed at least partially between the first and second passive radiators, a magnet disposed within the driver housing, a voice coil and a diaphragm facing downwards towards the lower surface of the device housing; and an annular sound channel disposed along the bottom portion of the device housing adjacent to the diaphragm of the active driver.

The present disclosure provides a composite electrode, an acoustic sensor using the composite electrode, and a manufacturing method of the composite electrode. The composite electrode includes a conductive layer, and a semiconductor high-molecular polymer layer formed on the conductive layer. The semiconductor high-molecular polymer layer has a three-dimensional mesh structure. The acoustic sensor includes a base; the above-mentioned composite electrode formed on the base; an organic layer formed on the composite electrode; and a top electrode formed on the organic layer.