A speaker includes: an edge having an outer circumference attached on an edge mounting portion of a resin frame by a resin ring provided on a front surface of the outer circumference. Interposed between the edge mounting portion and the resin ring is a projection-like energy director having a part abutting on one of the members and being melted from the part by ultrasonic waves.

The present disclosure provides a composite electrode, an acoustic sensor using the composite electrode, and a manufacturing method of the composite electrode. The composite electrode includes a conductive layer, and a semiconductor high-molecular polymer layer formed on the conductive layer. The semiconductor high-molecular polymer layer has a three-dimensional mesh structure. The acoustic sensor includes a base; the above-mentioned composite electrode formed on the base; an organic layer formed on the composite electrode; and a top electrode formed on the organic layer.

Hearing aid devices, methods of manufacture, methods of use, and kits are provided. In certain aspects, the hearing aid devices comprise an apparatus having a transducer and a retention structure comprising a shape profile corresponding to a tissue of the user, and a layer of elastomer.

A damper and a speaker apparatus includes the damper, which suppresses damage to an oscillatory system from an excessive input signal, enabling an efficiency increase of the speaker apparatus. As a damper has a planar surface, undue deformation of the oscillatory system due to an excessive input signal is suppressed, and damage to the oscillatory system can be suppressed. Furthermore, since the deformation of a corrugation portion by a normal input signal is hardly prevented, a reduction in sound pressure of the speaker apparatus with respect to an input signal is suppressed, enabling an increase in efficiency. Furthermore, the planar surface is extended at a height in a thickness direction different from that of an attachment portion. Thus, rising portions are deformed when a voice coil bobbin is oscillated, enabling suppression of rupture of the damper in the vicinity of a boundary between the planar surface and the attachment portion.

A sensor includes a membrane electrode, a counter-electrode, and at least one spring. The sensor can include a structure; a membrane electrode, which is deformable as a consequence of pressure and which is in contact with the structure; a counter-electrode mechanically connected to the structure and separated from the membrane electrode by a gap; and at least one spring mechanically connected to the membrane electrode and the counter-electrode, so as to exert an elastic force between the membrane electrode and the counter-electrode.

A speaker, including: a magnetic circuit system, a vibration system, and a speaker support, the speaker support is provided with a mounting cavity, both the magnetic circuit system and the vibration system are mounted in the mounting cavity; the vibration system includes a metal diaphragm and a flexible connector; the metal diaphragm is placed in the mounting cavity; an inner periphery of the flexible connector is bonded to an outer periphery of the metal diaphragm, and an outer periphery of the flexible connector is bonded to an inner periphery of the speaker support. The overall rigidity of the vibration system of the speaker can be improved via adopting the metal diaphragm, and the overall performance of the speaker is improved.

A semiconductor device includes a substrate having an opening extending through the substrate and at least one support member on a sidewall of the opening, a vibration membrane on the substrate, a cover layer on the vibration membrane. The substrate, the vibration membrane, and the cover layer define a cavity. The opening exposes a lower surface portion of the vibration membrane. The at least one support member on the sidewall of the opening provides support to the vibration membrane in a deformation of the vibration membrane to prevent breakage.

A transducer assembly including a frame, a diaphragm positioned within the frame, a surround connecting the diaphragm to the frame, the surround having a corner section and a plurality of corrugations formed within the corner section, wherein each corrugation of the plurality of corrugations comprises a length dimension perpendicular to a line of maximum stress intersecting a radial axis of the corner section, a voice coil extending from one side of the diaphragm and a magnet assembly having a magnetic gap aligned with the voice coil.

The present application provides a piezoelectric microphone, and it includes a substrate having a back cavity and a piezoelectric cantilever diaphragm fixed to the substrate. The piezoelectric cantilever diaphragm includes a plurality of diaphragm flaps, and each of the diaphragm flaps has one end fixed to the substrate and another end suspended above the back cavity. Every two adjacent ones of the diaphragm flaps are spaced apart to form a gap. The piezoelectric microphone further comprises an elastically stretchable member connecting the two adjacent diaphragm flaps, and the elastically stretchable member is provided between at least one set of two adjacent ones of the diaphragm flaps. The piezoelectric microphone of the present disclosure has better performance.

The present application provides a piezoelectric microphone, including a substrate having a back cavity and a piezoelectric cantilever diaphragm fixed to the substrate. The piezoelectric cantilever diaphragm includes a first diaphragm located at its center and suspended above the back cavity, and a second diaphragm fixed to the substrate and provided around the first diaphragm. The second diaphragm includes a fixed end fixed to one side of the substrate and a movable end close to the first diaphragm side and suspended above the back cavity. The piezoelectric microphone further includes one or more elastically stretchable members each connecting the first diaphragm with the movable end. The piezoelectric microphone of the present disclosure has better performance.