H04R2307/025

MEMS device with enhanced membrane structure and method of forming the same

A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern having first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region. The via pattern further includes second lines extending from the anchored region of the membrane toward the central region of the membrane. Each of the second lines includes a length less than a length of each of the first lines.

DIAPHRAGM FOR HIGH PRESSURE WATERPROOF MICROSPEAKER AND HIGH PRESSURE WATERPROOF MICROSPEAKER INCLUDING THE SAME
20230156406 · 2023-05-18 ·

Provided are a diaphragm for a high water pressure waterproof microspeaker and a high pressure waterproof microspeaker including the same. The diaphragm for a high pressure waterproof microspeaker, which is provided in a microspeaker to reproduce sound, includes a center diaphragm and a side diaphragm, includes a center diaphragm attachment portion having a ring shape with a perforated center overall and attached to an outer periphery of the center diaphragm, a frame attachment portion attached to a frame, and a dome portion located between the center diaphragm attachment portion and the frame attachment portion and protruding upwardly or downwardly. The center diaphragm attachment portion of the side diaphragm includes an upper attachment portion attached to an upper surface of the center diaphragm and a lower attachment portion attached to a lower surface of the center diaphragm.

DISPLAY DEVICE
20220413617 · 2022-12-29 ·

A display device includes a display panel displaying an image, a lower frame disposed under the display panel, a first vibration element attached to a lower surface of the display panel and which generates a first vibration based on a first vibration signal, a second vibration element disposed under the lower frame and which generates a second vibration based on a second vibration signal, and a first vibration driver circuit which provides the first vibration signal to the first vibration element, where a phase of the second vibration signal is opposite to a phase of the first vibration signal.

Electronic Devices Having Optical and Audio Components
20220393714 · 2022-12-08 ·

An electronic device housing may include a display cover layer that overlaps an array of pixels. The cover layer or other portion of the housing may have an opening that forms an optical and audio port. Optical and audio components may be coupled to the port. A port cover may cover some or all of the port. The port cover may include one or more layers of mesh or other materials that allow light and sound to pass while blocking environmental contaminants. The optical components may include an ambient light sensor or other devices that receive light and/or may include devices that emit light. The audio components may include a microphone and/or a speaker. The optical component may emit or receive light that passes through the audio component. A structure in the interior of the housing may form a passageway coupled to the port through which sound and light passes.

Speaker diaphragm and speaker
11800287 · 2023-10-24 · ·

The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes two surface layers compounded together and at least one intermediate layer located between the two surface layers, wherein at least one of the surface layers is a thermoplastic polyester elastomer film layer, at least one of the intermediate layers is an adhesive layer, a thermoplastic polyester elastomer is a copolymer composed of a polyester hard segment A and a polyether or aliphatic polyester soft segment B, a thickness of the thermoplastic polyester elastomer film layer is 5-70 μm, and a thickness of the adhesive layer is 1-40 μm.

Diaphragm for sound generating device and sound generating device

Disclosed are a diaphragm for a sound generating device and a sound generating device. The diaphragm comprising at least one elastomer layer, wherein the elastomer layer is made of an ethylene propylene diene monomer; and the ethylene propylene diene monomer is formed by polymerizing three monomers, the three monomers being an ethylene monomer, a propylene monomer and a non-conjugated diene monomer respectively, a mass ratio of the ethylene monomer to the propylene monomer ranging from 0.25 to 4, and content of the non-conjugated diene monomer being 1%-15% of total content of the ethylene monomer and the propylene monomer. The ethylene propylene diene monomer has excellent high-temperature resistance and thermo-oxidative aging resistance; and after the rubber is made into the diaphragm, the diaphragm is capable of working in a high-temperature environment for a long time, maintaining not only excellent elasticity but also excellent anti-fatigue characteristic, thereby possessing excellent reliability.

Speaker diaphragm and speaker
11818559 · 2023-11-14 · ·

The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes two surface layers compounded together and at least one intermediate layer located between the two surface layers, at least one of the surface layers is a thermoplastic polyester elastomer film layer, and at least one of the intermediate layers is an adhesive layer, wherein the thermoplastic polyester elastomer film layer has a Young's module of 1-1000 MPa, a loss factor being greater than or equal to 0.015, and an elastic recovery rate after 10% strain being greater than or equal to 80%. The speaker diaphragm may be made very thin, thus reducing the weight of the speaker diaphragm, improving the space allowance for vibration, improving the sensitivity, and making the F.sub.0 of the speaker lower. Further, elastic area of the speaker diaphragm is wider and the resilience performance is excellent.

MEMS DEVICE WITH ENHANCED MEMBRANE STRUCTURE AND METHOD OF FORMING THE SAME
20230370783 · 2023-11-16 ·

A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.

PRESSURE WAVE GENERATING ELEMENT AND METHOD FOR PRODUCING THE SAME
20230370787 · 2023-11-16 ·

A pressure wave generating element that includes a support; a fiber layer on the support, the fiber layer containing a fiber having a surface thereof at least partially coated with a metal coating, and the fiber in the fiber layer being oriented in a predetermined direction; and a pair of electrodes arranged so as to apply a voltage in an orientation direction of the fiber of the fiber layer.

Package structure of micro speaker and method for forming the same

A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.