The present invention relates to a membrane plate structure for generating sound waves. The membrane plate structure comprises a first skin layer, a second skin layer, a foam core layer which is interposed between the first skin layer and the second skin layer, and two binding layers. At least one of the first skin layer and the second skin layer is attachable to a vibrating element for generating sound waves. The elastic modulus of the core layer and its density are lower than the elastic modulus and the density of the first skin layer and the second skin layer, so that a sandwich structure is achieved. The Young modulus and the shear modulus of first skin layer, the second skin layer, the core layer and the binding layers are not variating between each other of more than 30% between a temperature 20 C. and 150 C., particularly between 20 C. and 170 C., more particularly 20 C. and 180 C.

A micro-electro-mechanical (MEMS) structure and a method for forming the same are disclosed. The MEMS structure includes a sacrificial layer, a lower dielectric film, an upper dielectric film, a plurality of through holes and a protective film. The sacrificial layer comprises an opening. The lower dielectric film is on the sacrificial layer. The upper dielectric film is on the lower dielectric film. The plurality of through holes passes through the lower dielectric film and the upper dielectric film. The protective film covers side walls of the upper dielectric film and the lower dielectric film and a film interface between the lower dielectric film and the upper dielectric film.

The present invention relates to a membrane plate structure for generating sound waves. The membrane plate structure comprises a first skin layer, a second skin layer, a foam core layer which is interposed between the first skin layer and the second skin layer, and two binding layers. At least one of the first skin layer and the second skin layer is attachable to a vibrating element for generating sound waves. The elastic modulus of the core layer and its density are lower than the elastic modulus and the density of the first skin layer and the second skin layer, so that a sandwich structure is achieved. The Young modulus and the shear modulus of first skin layer, the second skin layer, the core layer and the binding layers are not variating between each other of more than 30% between a temperature 20 C. and 150 C., particularly between 20 C. and 170 C., more particularly 20 C. and 180 C.

A loudspeaker diaphragm (12) comprising a woven fibre body supports damping material (25), for example PVA polymer, on a rearward-facing surface (24). The woven fibre body may be formed of lengths (14) non-metallic fibre material (for example glass fibre) coating with a thin metal coating (32). The mass of the layer of damping material (25) may be significantly greater than the mass of the woven fibre body. An attractive sparkly looking loudspeaker diaphragm (12) may thus be provided which damps undesirable vibration whilst providing a flatter frequency-response curve (50).

According to an embodiment, a MEMS transducer includes a stator, a rotor spaced apart from the stator, and a multi-electrode structure including electrodes with different polarities. The multi-electrode structure is formed on one of the rotor and the stator and is configured to generate a repulsive electrostatic force between the stator and the rotor. Other embodiments include corresponding systems and apparatus, each configured to perform corresponding embodiment methods.

The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

An ultrasonic transducer includes a first diaphragm, one or more frame bodies, and one or more ultrasonic vibrators. The one or more frame bodies extend in a length direction and are bonded to the first diaphragm. The one or more ultrasonic vibrators are attached to the one or more frame bodies, respectively, and face the first diaphragm with a space therebetween. The first diaphragm is structured to resonate and vibrate in a direction orthogonal or substantially orthogonal to the first diaphragm in a phase opposite to a phase of the one or more ultrasonic vibrators. A dimension in the length direction inside the one or more frame bodies is equal to or greater than four times a dimension in a width direction orthogonal to the length direction inside the one or more frame bodies.

A film speaker includes a metal foil; a diaphragm apart from and opposed to the metal foil; an elastomer for supporting the diaphragm; and a voice coil disposed on the metal foil for producing magnetic field. The diaphragm includes a substrate layer and a magnetic material layer attached to a surface of the substrate layer for interacting with a magnetic field produced by the voice coil so as to drive the diaphragm to vibrate for generating sound.

A film speaker includes a metal foil, a diaphragm apart from and opposed to the metal foil, an elastomer for supporting the diaphragm, and a voice coil disposed on the metal foil for producing magnetic field. The diaphragm includes a polymer magnetic material layer and a metal foil reinforcing layer attached to a surface of the polymer magnetic material layer for interacting with the magnetic field produced by the voice coil so as to drive the diaphragm to vibrate for generating sound.

A micro-electro-mechanical (MEMS) structure and a method for forming the same are disclosed. The MEMS structure includes a sacrificial layer, a lower dielectric film, an upper dielectric film, a plurality of through holes and a protective film. The sacrificial layer comprises an opening. The lower dielectric film is on the sacrificial layer. The upper dielectric film is on the lower dielectric film. The plurality of through holes passes through the lower dielectric film and the upper dielectric film. The protective film covers side walls of the upper dielectric film and the lower dielectric film and a film interface between the lower dielectric film and the upper dielectric film.