The present disclosure provides a diaphragm and a sound generating device using the diaphragm. The diaphragm comprises a diaphragm body part, and a composite layer bonded to the center of the diaphragm body part. The composite layer comprises: a porous material layer; and a first metal layer and a second metal layer respectively disposed on two sides of the porous material layer. Compared with the prior art, the composite layer of the diaphragm adopts a composite structure composed of a porous material layer and metal layers, which can reduce the mass of the diaphragm and improve the modulus density ratio of the diaphragm while ensuring the rigidity of vibration. The porous structural material can increase the damping of the diaphragm, absorb the vibration energy under the specific resonant frequency, and thus effectively improve the high-frequency split vibration, reduce the distortion and improve the high pitched sound quality.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

The present disclosure discloses a flexible circuit board and a speaker. The flexible circuit includes a substrate, a first cover film attached to a side of the substrate and including at least a silica gel layer, a second cover film attached to the other side of the substrate, and a copper foil layer sealed between the substrate and the first cover film or between the substrate and the second cover film. Compared with the related art, the flexible circuit disclosed by the present disclosure has a higher strength.

A display apparatus includes a display module including a display panel configured to display an image, a rear cover on a rear surface of the display module, and a sound generating module at the rear cover and configured to vibrate the display module to generate sound, and a rear surface of the sound generating module is covered by the rear cover.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A speaker includes a frame, a vibration unit fixed to the frame, and a magnetic circuit unit fixed to the frame. The vibration unit includes a diaphragm fixed to the frame, and a coil configured to drive the diaphragm to vibrate and sound. The diaphragm includes a dome. The dome includes a first layer, a second layer and a third layer which are stacked sequentially in a direction from the coil to the diaphragm. The second layer includes a honeycomb structure. The third layer includes a body and a plurality of through holes extending through the body in a vibration direction of the diaphragm. The through holes communicate with the honey structure of the second layer form a resonance cavity.

Microphone arrays comprise several microphone capsules, the outputs of which being electronically combined for directional recording of sound. The directional and frequency properties of the microphone array depend on the number and positions of the microphone array. In order to obtain the smallest possible microphone array with only few microphone capsules, which, however, has an essentially uniform directional and frequency dependence over a speech frequency range, is scalable and robust against small incorrect positioning of the capsules, fifteen or twenty-one microphone capsules (K.sub.15,11-K.sub.15,35, K.sub.21,11-K.sub.21,37) are arranged on a carrier such that they lie on three similar branches, each with the same number of microphone capsules, which are rotated against each other by 120°. Each of the microphone capsules lies on a corner of a triangle of a grid in a flat isometric coordinate system with three axes rotated by 120° against each other and forming the grid of equilateral triangles.

An audio system includes an audio panel. The audio panel includes a first face plate, a second face plate, and a core that includes a plurality of structural members that extend between the first face plate and the second face plate. The plurality of structural members define a plurality of cavities in the core. The audio system also includes a first piezoelectric actuator mounted to at least one of the first face plate, the second face plate, and the core. The first piezoelectric actuator is configured to convert electrical signals into mechanical energy to cause the audio panel to generate sound.

The present invention provides a diaphragm structure of a sounding apparatus comprising: a thin-film layer; a first circuit thin-film layer fixed on a first side of the thin-film layer by means of a first electrolytic bonding layer; a second circuit thin-film layer fixed on a second side of the thin-film layer by means of a second electrolytic bonding layer; multiple holes passing through the first circuit thin-film layer, the thin-film layer and the second circuit thin-film layer; and multiple conductive layers disposed on inner circumferential walls of the holes and in contact with the first circuit thin-film layer and the second circuit thin-film layer. In the diaphragm structure provided by the present invention, instead of using back adhesives, electrolytic bonding is used to fix the circuit thin-film layers on two sides of a thin-film layer, thereby greatly reducing the thickness of the diaphragm structure.